INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8272CZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MC8640DTHX1000HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	1.05 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e0
MPC8347ECZQAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8541CPXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541ECVTAJD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e2
MPC8560CVTAQLC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8540CVT667LB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
LS1012AXN7HKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V	16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm	9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS	.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3		800 rpm	YES
P1010NXN5KFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
MPC8280CZQQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	NO
MC8640DTVJ1000HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	YES
SVF522R2K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	17 mm		YES	16		40	260	17 mm	CMOS	3.3 V			.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
MPC8245TVV300D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32	66 MHz	30	245	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	300 rpm	YES	e1
MPC8541CPXALE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
SPC5200CBV400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32	32		GRID ARRAY		1.42 V	85 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	30	240	27 mm	CMOS	1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
MPC8349CZUAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8555ECVTAQF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	15	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS	1.3 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8349CVVAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES
MPC5123YVY300BR	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	0	32	1.4,3.3	GRID ARRAY	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	0		NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	YES
MPC8349CZUAGF	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B672	1	Not Qualified	400 rpm	YES
MC8610TPX1066JZ	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.7 mm	29 mm		YES	64				29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1066 rpm	YES
MPC8313CZQAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	YES	e0
MPC8555ECVTALDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8347ECVVALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8541ECVTALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC866TCZP100A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	220	25 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e0
T2081NXN8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS	1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3		1800 rpm	YES	e1
P1010NXN5KHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3		1000 rpm	NO	e2
MPC8541CVTAPE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8347ECVRADF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES	e1
MPC8567CVTAQGG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel		-45 Cel		BOTTOM													Microprocessors	1 mm		S-PBGA-B1023		Not Qualified	1000 rpm
MPC8536CVJAQGA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783	3		1000 rpm	YES	e2
MPC8347CZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
P1010CXE5KFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
MPC8541CPXAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8536CVJAULA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783	3		1333 rpm	YES	e2
P1010CXE5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8541CVTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8540CVT833JB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MC8640THX1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	1.05 V	4	Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	NO	e0
MPC866PCVR100A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	32	100 MHz	30	245	25 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e1
SVF322R3K1CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	TIN	QUAD	1.6 mm	24 mm		YES	0		40	260	24 mm	CMOS	3.3 V			.5 mm	FLOATING POINT	S-PQFP-G176	3		266 rpm	YES	e3
MPC8347ECZQADDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	266 rpm	YES
MPC8572ECVTATLE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm	33 mm		YES	64	133 MHz			33 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1023			1200 rpm	YES
MPC8560CVT833JB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	883 rpm	YES
MPC8349CZUAJD	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B672	1	Not Qualified	533 rpm	YES
P1010NXE5KFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
MPC8347ECZUALFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.