INDUSTRIAL Microprocessors 1,818

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC8640TVU1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel		BOTTOM	2.77 mm		33 mm		YES	32	166.66 MHz			33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	NO
MPC8541CPXAKE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8347CVVAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8555ECVTALE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8347CZQAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8555ECVTAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8540CVT833LC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8280CZQTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm		27 mm		YES	64	100 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8555CVTAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
P1010CXE5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1010NXE5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1010NXE5DHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MC8640DTHX1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	NO	e0
MC8610TVT800GZ	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.7 mm		29 mm		YES	64				29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
MPC8541ECVTAKE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32	1.2,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
P1010CXE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8347CVRAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
LS1012AXN7HKA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		800 rpm	YES
MPC8541CPXALF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8555ECPXAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555CPXAQEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541CVTAQD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8555ECVTAKD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8572ECVJAVNE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1023			1500 rpm	YES
MPC8560CVTAQJB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MC8640THJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel		BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO
MPC8567ECVTAQGG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel		-45 Cel		BOTTOM																Microprocessors	1 mm		S-PBGA-B1023		Not Qualified	1000 rpm
MPC8541CVTAKD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8567ECVTANGG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel		-45 Cel		BOTTOM																Microprocessors	1 mm		S-PBGA-B1023		Not Qualified	800 rpm
MC8640TVU1000HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		32	32		GRID ARRAY		1 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e2
MPC8555ECPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8349ECVVAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e2
LS1012AXE7HKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		800 rpm	YES
T1013NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8314ECVRADDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
T2081NXE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
T1013NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
LS1028AXE7KQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	8	14	64		GRID ARRAY, FINE PITCH	BGA448,30x30,30	.97 V	105 Cel		-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	1	33		.75 mm	FIXED-POINT	S-PBGA-B448	3		1000 rpm	YES
MPC8555ECPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8555ECVTAKF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8343ECVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8280CVRPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm		27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
P1010CXE5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MC9328MX21SCVK	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.49 mm		14 mm		YES	32	32 MHz	40	260	14 mm	CMOS		1.5 V				.65 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MPC8541ECVTALE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8313CZQAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e0
T1013NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
MPC8313ECZQAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3		400 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.