INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8347CVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8347ECZQAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES	e0
MPC866TCVR100A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e1
LS1012AXN7EKA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm	9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS	.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3		600 rpm	YES
MPC8280CZQSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	83.33 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MPC8347CVVADDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	266 rpm	YES
MPC8555ECPXAQEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8347ECVRALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES	e1
MPC8265ACZUPIB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES				32	2,3.3	GRID ARRAY	BGA480,29X29,50		105 Cel		-40 Cel		BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	266 rpm
MPC8347ECZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8555ECVTAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8265ACZUMIB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES				32	2,3.3	GRID ARRAY	BGA480,29X29,50		105 Cel		-40 Cel		BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	300 rpm
MPC8555ECPXAQF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		15	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS	1.3 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
P1010CXE5KFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
MPC8347CZQAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8349ECZUALFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	667 rpm	YES
MPC8572ECLVTATLE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm	33 mm		YES	64	133 MHz			33 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1023			1200 rpm	YES
MPC8555CPXAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8349ECZUAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e0
MPC8572ELVTAVNE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		32	32		GRID ARRAY		1.045 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm	33 mm		YES	32	133 MHz	30	245	33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023	3		1500 rpm	YES	e2
MPC8555ECVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8245TVV333D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	333 rpm	YES	e1
MPC8343CVRADDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
P1010NXN5FHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8555ECVTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541ECPXAQD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC859PCVR100A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e1
SPC5123YVY300BR	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	AEC-Q100	0	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	0	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	YES
MPC8347CVVALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8541ECPXALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8260ACZUPIB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES				32	2,3.3	GRID ARRAY	BGA480,29X29,50		105 Cel		-40 Cel		BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	266 rpm
T1040NXN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64		30	250	23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
MPC8272CVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		32	32		GRID ARRAY		1.425 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8349CVVAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC857DSLCVR66B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32				25 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES	e1
MPC8349ECZUAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8347ECVRAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES	e1
MPC8555CPXALDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8555ECVTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC850DSLCVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC8568ECVTANGG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel		-45 Cel		BOTTOM													Microprocessors	1 mm		S-PBGA-B1023		Not Qualified	800 rpm
MC8640TVJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	.95 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO	e2
MPC8560CVTAQFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8280CZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8349ECVVAJD	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B672		Not Qualified	533 rpm	YES
MPC8347CZQALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MPC8347ECVRAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8347ECZQALFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.