NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
935318895528	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN									40	260											3				e3
PPC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32		GRID ARRAY		1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.25 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
935340593557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
935312823557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
PPC8567EVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm		YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
S9S08RN16W2MLC	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	0	8		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	2.7 V	125 Cel	8	-40 Cel	TIN	QUAD	1.6 mm	2048	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14 mA	3 V		2		.8 mm	FIXED POINT	S-PQFP-G32	3		20 rpm	YES	e3
P5020NSE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
PPC7448HX1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz			25 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	1250 rpm	YES
935316728557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
XPC7445RX800NC	NXP Semiconductors	MICROPROCESSOR, RISC
BSC9132NXN7MNMB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm		23 mm		YES	32		30	245	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
P2020PSE2MFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO
935311854534	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
935312777528	NXP Semiconductors	MICROPROCESSOR
935315392557	NXP Semiconductors	MICROPROCESSOR
S9S08RN48W1MLCR	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
T4161NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS						1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
935318209557	NXP Semiconductors	MICROPROCESSOR
P2020NSN2NFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO	e2
935321085557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
XPC850ZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
935373993699	NXP Semiconductors	MICROPROCESSOR, RISC
P2010NSN2HHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		800 rpm	YES	e2
935373203557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
PPC7448VS600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	600 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
XPC7455RX867LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.65 V		36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.55 V				TIN LEAD	BOTTOM	3.22 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.6 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	867 rpm	YES	e0
PCIMX536AVV8C	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		26	32		GRID ARRAY, FINE PITCH		1.05 V	125 Cel		-40 Cel		BOTTOM	1.85 mm		19 mm		YES	32	27 MHz			19 mm	CMOS		1.1 V				.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES
935324844557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
935375881538	NXP Semiconductors	MICROPROCESSOR, RISC
935323854557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
SVF321R3K2CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC
PPC7448VS1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32		GRID ARRAY		1.1 V	105 Cel		0 Cel		BOTTOM	1.8 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.15 V				1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
P5010NXE1TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
935321098557	NXP Semiconductors	MICROPROCESSOR, RISC																				Tin/Lead/Silver (Sn/Pb/Ag)																					4				e0
935320314557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
935311939557	NXP Semiconductors	MICROPROCESSOR
PPC7448HX600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	600 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
935320457557	NXP Semiconductors	MICROPROCESSOR, RISC
935323587557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
P5020NSN1TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
PPC7448VU1600LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32		GRID ARRAY		1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.25 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
XPC7445RX867LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		25 mm		YES	64	133 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	867 rpm	YES
S9S08RNA32W1MLCR	NXP Semiconductors	MICROPROCESSOR																													40	260											3
P2020PSN2NFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P5020NSN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
935323884557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
XPC755BRX350LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V					GRID ARRAY		1.9 V					BOTTOM					YES						CMOS		2 V					FIXED POINT	R-CBGA-B360			350 rpm	NO
935339744551	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.