NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
935416244518	NXP Semiconductors	MICROPROCESSOR, RISC
935424213557	NXP Semiconductors	MICROPROCESSOR, RISC
935424214557	NXP Semiconductors	MICROPROCESSOR, RISC
935420324019	NXP Semiconductors	MICROPROCESSOR, RISC
935416243557	NXP Semiconductors	MICROPROCESSOR, RISC
935416243518	NXP Semiconductors	MICROPROCESSOR, RISC
935416244557	NXP Semiconductors	MICROPROCESSOR, RISC
935420326019	NXP Semiconductors	MICROPROCESSOR, RISC
935325277557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260									3				e2
PPC7448VU1420LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	105 Cel		0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.2 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
SVF511R3K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	17 mm		YES	16		40	260	17 mm	CMOS	3.3 V			.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
SCF5235F4CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B256	3		150 rpm	YES	e1
SVF312R3K2CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC
BSC9131CJN1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
935313697557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER COPPER								40	260									3				e1
P5020NXE1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
S9S08RN32W1CLF	NXP Semiconductors	MICROPROCESSOR																											40	260									3
XPC850SRZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
P5040PXE12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
XPC850ZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
935319132557	NXP Semiconductors	MICROPROCESSOR, RISC
XPC755BPX400LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V				GRID ARRAY		1.9 V					BOTTOM				YES						CMOS	2 V				FIXED POINT	R-PBGA-B360			400 rpm	NO
P2020PXE2HHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
P2020PXN2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
BSC9131CSE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
PS32V234CMN0AVUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		64		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel		BOTTOM	2.44 mm	17 mm		YES					17 mm	CMOS	1 V			.65 mm	FLOATING POINT	S-PBGA-B621			1000 rpm	YES
P2020NSE2KHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz	40	260	31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO	e2
935315589534	NXP Semiconductors	MICROPROCESSOR																			TIN								40	260									3				e3
935311547557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER								30	245									3				e1
935313618557	NXP Semiconductors	MICROPROCESSOR, RISC
PPC7448VS1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz			25 mm	CMOS	1.1 V			1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
935316067518	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER COPPER								40	260									3				e1
MPE603EFE133TX	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	CERAMIC, GLASS-SEALED	YES	YES	3.465 V	32	32		FLATPACK, FINE PITCH		3.135 V					QUAD	4.15 mm	31.305 mm		YES	64	66.67 MHz			31.305 mm	CMOS	3.3 V			.5 mm	FLOATING POINT	S-GQFP-G240		Not Qualified	133.33 rpm	YES
935320419557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER								40	260									3				e2
P2020NSN2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS	1.05 V	4	Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
P5010NSE1TNB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
BSC9132NLE7PNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm	23 mm		YES	64	100 MHz			23 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B780			1400 rpm	YES
935321099557	NXP Semiconductors	MICROPROCESSOR, RISC																			Tin/Lead/Silver (Sn/Pb/Ag)																		4				e0
935324069557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER								40	260									4				e1
P5021PSN1TMB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
935365842518	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER								40	260									3				e1
935373994699	NXP Semiconductors	MICROPROCESSOR, RISC
XPC7410RX500PD	NXP Semiconductors	MICROPROCESSOR
935309485557	NXP Semiconductors	MICROPROCESSOR, RISC
PPC8567ECVTAQGGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm	33 mm		YES	0	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1000 rpm	YES	e2
935310343557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260									3				e2
BSC9132NXN7KNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm	23 mm		YES	64	100 MHz			23 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
S9S08RN32W1VLFR	NXP Semiconductors	MICROPROCESSOR																											40	260									3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.