NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P2020PXE2MHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm	YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO
935316679557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN							30	245									3				e3
BSC9131NXE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm	21 mm	YES	32		30	245	21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520	3		1000 rpm	YES	e1
SVF532R3N2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC
BSC9132NLN7KNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm	23 mm	YES	64	100 MHz			23 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
P2020PSN2NFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm	YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P2010NSE2HHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64	100 MHz	40	260	31 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-PBGA-B689	3		800 rpm	YES	e2
XPC823ZT75A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel		0 Cel		BOTTOM			YES						CMOS	2.5 V				FIXED POINT	S-PBGA-B256			75 rpm	YES
XPC850ZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm	23 mm	YES	32				23 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
BSC9131CXE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm	21 mm	YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
M68000LC	NXP Semiconductors	MICROPROCESSOR
XPC7455RX1000PC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.6 V	36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.52 V				Tin/Lead (Sn/Pb)	BOTTOM	3.2 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.57 V		Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	1000 rpm	YES	e0
P2020NSN2MFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64	100 MHz	40	260	31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO	e2
T4241NSN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm	YES	64	133.3 MHz	30	250	45 mm	CMOS	1.025 V			1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
S9S08RN16W2VTJ	NXP Semiconductors	MICROPROCESSOR																			TIN							40	260									3				e3
935318853557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER							30	250									3				e1
935324805557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER							40	260									3				e2
PPC7448VU1000NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm	NO	0	1000 MHz			25 mm	CMOS	1 V			1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
935312822557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER							40	260									3				e2
S9S08RNA8W2CTJ	NXP Semiconductors	MICROPROCESSOR																			TIN							40	260									3				e3
935309613557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER							30	245									3				e1
P2010NSE2HFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64	100 MHz	40	260	31 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-PBGA-B689	3		800 rpm	YES	e2
SVF521R3K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER							40	260									3				e1
P2010NXN2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64	100 MHz	40	260	31 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-PBGA-B689	3		1000 rpm	YES	e2
XPC8260CVVIHBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY, LOW PROFILE		1.7 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm	37.5 mm	YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
935319233557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER							40	260									3				e1
935325996557	NXP Semiconductors	MICROPROCESSOR, RISC
935316686518	NXP Semiconductors	MICROPROCESSOR
935312226557	NXP Semiconductors	MICROPROCESSOR																			TIN							40	260									3				e3
PPC8567EVTANGGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm	33 mm	YES	0	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	800 rpm	YES	e2
P2020PSE2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm	YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
P5040NSN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
P4040NSN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm	YES	64	133.3 MHz	30	245	37.5 mm	CMOS	1 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1500 rpm	YES	e1
ASC8851ET/M2,557	NXP Semiconductors
935322071557	NXP Semiconductors	MICROPROCESSOR																			TIN							40	260									3				e3
XPC7410RX550PC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL		BGA	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.05 V				GRID ARRAY		1.95 V					BOTTOM			YES						CMOS	2 V				FIXED POINT	X-CBGA-B			550 rpm	YES
P2020PSE2NHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm	YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
BSC9131NLN1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm	21 mm	YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
PPC7448VS1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.1 V	0	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm	NO	0	1267 MHz			25 mm	CMOS	1.05 V			1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1267 rpm	YES
XPC8260CVVIFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY, LOW PROFILE		1.7 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm	37.5 mm	YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
935375881699	NXP Semiconductors	MICROPROCESSOR, RISC
935331867557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER							30	250									3				e1
P2020NXE2MFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm	YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO
935318612557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER							30	250									3				e1
P5010NXN1QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm	37.5 mm	YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1600 rpm	YES
P2020NSN2NHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64		40	260	31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689	3		1333 rpm	NO	e2
S9S08RNA8W2CLFR	NXP Semiconductors	MICROPROCESSOR																			TIN							40	260									3				e3
935315543557	NXP Semiconductors	MICROPROCESSOR																			TIN							40	260									3				e3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.