NXP Semiconductors Microprocessors 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

935320957557

NXP Semiconductors

MICROPROCESSOR

TIN

40

260

3

e3

935351577557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

T4240NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.055 V

16

GRID ARRAY

.995 V

TIN SILVER COPPER

BOTTOM

3.33 mm

45 mm

YES

64

133.3 MHz

30

250

45 mm

CMOS

1.025 V

1 mm

FIXED POINT

S-PBGA-B1932

3

1800 rpm

YES

e1

935316453557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN

40

260

3

e3

P2020NSE2HFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

40

260

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

800 rpm

NO

e2

S9S08RNA16W2VTGR

NXP Semiconductors

MICROPROCESSOR

TIN

40

260

3

e3

S9S08RNA32W1VLCR

NXP Semiconductors

MICROPROCESSOR

40

260

3

BSC9131CSE1HHKB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

0 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

935320222557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

3

e1

XPC821CZP25

NXP Semiconductors

P5010NSN1VNB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY, HEAT SINK/SLUG

1.05 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

2000 rpm

YES

e1

XPC750PRX333RE

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

2 V

32

GRID ARRAY

1.8 V

BOTTOM

3.2 mm

25 mm

ALSO REQUIRES 3.3V SUPPLY

NO

100 MHz

25 mm

CMOS

1.9 V

1.27 mm

FIXED POINT

S-CBGA-B360

Not Qualified

333 rpm

YES

935310345557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

935325244557

NXP Semiconductors

MICROPROCESSOR, RISC

935323548557

NXP Semiconductors

MICROPROCESSOR

P5010NXE1QMB,557

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1600 rpm

YES

ASC8851ET/M2,551

NXP Semiconductors

PPC7448VS1420LD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.25 V

36

32

GRID ARRAY

1.15 V

105 Cel

0 Cel

BOTTOM

1.8 mm

25 mm

YES

64

200 MHz

25 mm

CMOS

1.2 V

1.27 mm

FLOATING POINT

S-CBGA-N360

Not Qualified

1420 rpm

YES

935309514557

NXP Semiconductors

MICROPROCESSOR

TIN SILVER COPPER

40

260

3

e1

P2020NSE2HHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

800 rpm

NO

e2

P4080NSN1PNB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

16

133.3 MHz

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1500 rpm

YES

e1

MPE603RRX300LX

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

255

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

2.625 V

32

32

GRID ARRAY

2.375 V

BOTTOM

3 mm

21 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

21 mm

CMOS

2.5 V

1.27 mm

FIXED POINT

S-CBGA-B255

Not Qualified

300 rpm

YES

PPC7448VS867ND

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

867 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

867 rpm

YES

T4240NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.055 V

16

GRID ARRAY

.995 V

TIN SILVER COPPER

BOTTOM

3.33 mm

45 mm

YES

64

133.3 MHz

30

250

45 mm

CMOS

1.025 V

1 mm

FIXED POINT

S-PBGA-B1932

3

1667 rpm

YES

e1

935313705557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

40

260

3

e1

P5021PSE12QC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

XPC823EZT75B2

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

26

32

3.3

GRID ARRAY

BGA256,23X23,50

3 V

0 Cel

Tin/Lead/Silver (Sn/Pb/Ag)

BOTTOM

2.35 mm

23 mm

YES

32

5 MHz

30

220

23 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

75 rpm

YES

e0

BSC9131NJN1KHHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

XCF5102PV33A

NXP Semiconductors

MICROPROCESSOR, RISC

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

YES

32

3.3

FLATPACK

QFP144,.87SQ,20

0 Cel

QUAD

CMOS

3.3 V

Microprocessors

.5 mm

S-PQFP-G144

Not Qualified

33 rpm

935318581557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

3

e1

935351578518

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

935312116557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

30

245

3

e2

MSCMMX6XYCM08AA

NXP Semiconductors

MICROPROCESSOR, RISC

P5040NXE7TMC,557

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

XPC7455RX600LC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

483

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.65 V

36

32

1.3,1.5/2.5,1.8/2.5

GRID ARRAY

BGA483,22X22,50

1.55 V

TIN LEAD

BOTTOM

3.22 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.6 V

Microprocessors

1.27 mm

FLOATING POINT

S-CBGA-B483

Not Qualified

600 rpm

YES

e0

PPC8567VTANGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

800 rpm

YES

e2

BSC9132NJE7PNMB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

32

GRID ARRAY, FINE PITCH

.97 V

BOTTOM

2.53 mm

23 mm

YES

64

100 MHz

23 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B780

1400 rpm

YES

935319163557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

S9S08RNA32W1MLH

NXP Semiconductors

MICROPROCESSOR

40

260

3

935323241557

NXP Semiconductors

MICROPROCESSOR, RISC

T4240NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.055 V

16

GRID ARRAY

.995 V

TIN SILVER COPPER

BOTTOM

3.33 mm

45 mm

YES

64

133.3 MHz

30

250

45 mm

CMOS

1.025 V

1 mm

FIXED POINT

S-PBGA-B1932

3

1667 rpm

YES

e1

SCF5250PV120

NXP Semiconductors

MICROPROCESSOR

OTHER

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

24

32

FLATPACK, LOW PROFILE, FINE PITCH

1.08 V

70 Cel

-20 Cel

QUAD

1.6 mm

20 mm

YES

16

33.86 MHz

20 mm

CMOS

1.2 V

.5 mm

FIXED POINT

S-PQFP-G144

120 rpm

YES

S9S08RNA8W2VTGR

NXP Semiconductors

MICROPROCESSOR

TIN

40

260

3

e3

XPC750PRX366RE

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

2.1 V

32

32

GRID ARRAY

2 V

65 Cel

0 Cel

TIN LEAD

BOTTOM

3.2 mm

25 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

64

100 MHz

25 mm

CMOS

2.05 V

1.27 mm

FLOATING POINT

S-CBGA-B360

Not Qualified

366 rpm

YES

e0

935324809557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

3

e1

SVF521R3K1CMK4

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

364

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

40

260

17 mm

CMOS

3.3 V

.8 mm

FLOATING POINT

S-PBGA-B364

3

400 rpm

YES

e1

935320381528

NXP Semiconductors

MICROPROCESSOR

935316122557

NXP Semiconductors

MICROPROCESSOR, RISC

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.