529 Other Function uPs,uCs & Peripheral ICs 72

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX535DVV1C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V			0.9/1.25,1.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.25 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e2
MCIMX535DVV1CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V			0.9/1.25,1.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.25 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e2
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B529	3		e2
MCIMX6X4EVM10AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3		e1
MCIMX515DJM8CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
MCIMX6X4CVM08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3		e1
MCIMX515DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
MCIMX535DVV1B	Freescale Semiconductor	SYSTEM ON CHIP		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.25 V			.8 mm		S-PBGA-B529	3	Not Qualified	e2
MCIMX536AVV8C	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e2
MCIMX534AVV8C	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e2
MCIMX6X4AVM08AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3		e1
SCIMX538DZK1C	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	529	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V			0.9/1.25,1.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA529,23X23,32	1.2 V				BOTTOM	.986 mm		12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	1.25 V	Graphics Processors		.5 mm		S-PBGA-B529		Not Qualified
MCIMX6X4CVM08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3		e1
ADSP-SC589-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm		19 mm						19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B529
MCIMX6X4EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3		e1
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B529	3		e2
MCIMX6X4AVM08AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3		e1
MCIMX512CJM6CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
MCIMX513DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm		19 mm						19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B529
MCIMX515CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
MCIMX512CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
MCIMX512DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
VCBUP7CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4		e1
TMSDM6467TCUT1TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				GRID ARRAY, FINE PITCH		1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.3 V			.8 mm		S-PBGA-B529	4		e1
TMX320DM6467ZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel		BOTTOM	3.1 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529		Not Qualified
VCBUP7TC6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4		e1
VCBUP7CT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4		e1
TMSDM6467CCUT6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4		e1
TMSDM6467CCUT7TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4		e1
TMSDM6467CCUTV6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4		e1
TMS320DM6467CZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS32DM6467CCUTAV6	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TCUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS	1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TZUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TZUTD1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUTV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified
TMS320DM6467TCUTL1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm		48	35 MHz	30	245	19 mm	CMOS	1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TCUTD1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS	1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.