900 Other Function uPs,uCs & Peripheral ICs 214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
TCI6630K2LXCMSA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
TCI6630K2LSCMSA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
TCI6630K2LXCMS24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
66AK2L06XCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm	25 mm			30	245	25 mm	CMOS	1.05 V			.8 mm	S-PBGA-B900	4		e1
TCI6630K2LCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
TCI6630K2LCMSA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
66AK2L06XCMS	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm	25 mm			30	245	25 mm	CMOS	1.05 V			.8 mm	S-PBGA-B900	4		e1
TCI6630K2LDCMSA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
TCI6630K2LSCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
TCI6630K2LDCMS24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
TCI6630K2LSCMS24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V					BOTTOM								CMOS	.95 V				S-PBGA-B900
XQZU5EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm				225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQ7Z030-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm					31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQZU15EG-1FFRC900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	31 mm			40	245	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQZU15EG-L1FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	31 mm			40	245	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQZU7EV-2FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm				225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQZU15EG-1FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	31 mm			40	245	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQ7Z045-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm					31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQZU5EV-2FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm				225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQZU15EG-2FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	31 mm			40	245	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQ7Z045-1RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm					31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQ7Z030-1RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm					31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQ7Z100-L2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel			BOTTOM	3.44 mm	31 mm			NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS				1 mm	S-PBGA-B900
XQ7Z030-1RF900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.44 mm	31 mm					31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQZU5EV-1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm				225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQ7Z045-1RF900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.44 mm	31 mm					31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQZU7EV-1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm				225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XQZU5EV-L1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm				225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XCZU9CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel			BOTTOM	2.88 mm	31 mm					31 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU6CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel			BOTTOM	2.88 mm	31 mm					31 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU5EG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XC7Z035-L2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.35 mm	31 mm					31 mm	CMOS	1 V			1 mm	S-PBGA-B900
XCZU5CG-2LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0	30	245	31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU7EV-1LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU9CG-L1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B900	4		e1
XCZU9CG-1LFFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.42 mm	31 mm		0	30	245	31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU4CG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU5EV-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU15EG-L1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B900	4		e1
XCZU5CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B900	4		e1
XCZU9CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel			BOTTOM	2.88 mm	31 mm					31 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU5CG-1LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU5EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm			30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XCZU6EG-2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.42 mm	31 mm			30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XC7Z045-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm					27 mm	CMOS	1 V			1 mm	S-PBGA-B900
XCZU6CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel			BOTTOM	2.88 mm	31 mm					31 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU7EV-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU7CG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.