BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU25DR-2FSVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU5CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU25DR-L1FFVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU25DR-L1FSVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

240

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU25DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU5EV-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XC7Z035-2FBG676I

Xilinx

SYSTEM ON CHIP

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA676,26X26,40

.95 V

100 Cel

-40 Cel

BOTTOM

2.54 mm

27 mm

27 mm

CMOS

1 V

1 mm

S-PBGA-B676

CSR8675C-IBBH-R

Qualcomm

MICROPROCESSOR CIRCUIT

BALL

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

X-PBGA-B

XCZU4EV-L1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XC7Z100-L2FFG900I

Xilinx

SYSTEM ON CHIP

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA900,30X30,40

.95 V

100 Cel

-40 Cel

BOTTOM

3.24 mm

27 mm

27 mm

CMOS

1 V

1 mm

S-PBGA-B900

XCZU7EV-3FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU7EV-3FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

35 mm

35 mm

CMOS

.9 V

1 mm

S-PBGA-B1156

4

e1

MPFS250T-FCG1152E

Microchip Technology

PROGRAMMABLE SoC

BALL

1152

BGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY

BGA1152,34X34,40

.97 V

100 Cel

0 Cel

BOTTOM

2.99 mm

35 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

35 mm

CMOS

1 V

1 mm

S-PBGA-B1152

MPFS250T-FCG1152I

Microchip Technology

PROGRAMMABLE SoC

BALL

1152

BGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY

BGA1152,34X34,40

.97 V

100 Cel

-40 Cel

BOTTOM

2.99 mm

35 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

35 mm

CMOS

1 V

1 mm

S-PBGA-B1152

XCZU11EG-2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

40 mm

30

245

40 mm

CMOS

.85 V

1 mm

R-PBGA-B1517

4

e1

XCZU15EG-2FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

10AS066N3F40E2LG

Intel

SoC

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

.93 V

GRID ARRAY

BGA1517,39X39,40

.87 V

100 Cel

0 Cel

BOTTOM

3.35 mm

40 mm

ALSO OPERATES AT 0.95V NOMINAL SUPPLY

40 mm

TSMC

.9 V

1 mm

S-PBGA-B1517

XCZU11EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU5CG-L2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

10AS032E4F29I3SG

Intel

SoC

BALL

780

BGA

SQUARE

PLASTIC/EPOXY

YES

.93 V

GRID ARRAY

BGA780,28X28,40

.87 V

100 Cel

-40 Cel

BOTTOM

3.35 mm

29 mm

29 mm

TSMC

.9 V

1 mm

S-PBGA-B780

XCZU3EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU48DR-2FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

MPC8248CVRTIEA

NXP Semiconductors

SoC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

1.5,3.3

GRID ARRAY

BGA516,26X26,40

1.425 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.55 mm

27 mm

30

245

27 mm

CMOS

1.5 V

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

3

Not Qualified

e2

XC7Z030-1FBG484C

Xilinx

SYSTEM ON CHIP

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA484,22X22,40

.95 V

85 Cel

0 Cel

BOTTOM

2.54 mm

23 mm

23 mm

CMOS

1 V

1 mm

S-PBGA-B484

XCZU25DR-1FSVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU25DR-L2FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU2CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU3EG-1SBVA484I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

CMOS

.85 V

R-PBGA-B484

4

e1

XCZU4EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU5CG-2FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7EG-2FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

40 mm

30

245

40 mm

CMOS

.85 V

1 mm

R-PBGA-B1517

4

e1

XCZU7EG-3FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1517

4

e1

XCZU7EG-L1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XCZU7EG-2FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU2EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B625

4

e1

XCZU5CG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU9CG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU28DR-2FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU5EG-L2FBVB900E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

BGA900,30X30,40

.698 V

110 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.88 mm

31 mm

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

31 mm

CMOS

.72 V

1 mm

R-PBGA-B900

4

e1

XCZU5EV-2FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

TCI6630K2LCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

XCZU11EG-L1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU15EG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9EG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

MPFS250T-1FCG1152E

Microchip Technology

PROGRAMMABLE SoC

BALL

1152

BGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY

BGA1152,34X34,40

.97 V

100 Cel

0 Cel

BOTTOM

2.99 mm

35 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

35 mm

CMOS

1 V

1 mm

S-PBGA-B1152

XCZU4EV-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU5EG-2FBVB900E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

BGA900,30X30,40

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.88 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

MPFS250T-1FCG1152I

Microchip Technology

PROGRAMMABLE SoC

BALL

1152

BGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY

BGA1152,34X34,40

.97 V

100 Cel

-40 Cel

BOTTOM

2.99 mm

35 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

35 mm

CMOS

1 V

1 mm

S-PBGA-B1152

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.