BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU6EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU9CG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
10AS016E4F27E3LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	27 mm				27 mm	TSMC		.9 V		1 mm	S-PBGA-B672
10AS027H2F34E2LG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			35 mm	TSMC		.9 V		1 mm	S-PBGA-B1152
10AS032E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	29 mm				29 mm	TSMC		.9 V		1 mm	S-PBGA-B780
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1517,39X39,40		100 Cel	0 Cel		BOTTOM	3.5 mm	40 mm				40 mm	TSMC				1 mm	S-PBGA-B1517
10AS066H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm				35 mm	TSMC		.9 V		1 mm	S-PBGA-B1152
AC5520/SLH3P	Intel			BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES		1.1,1.5,1.8	GRID ARRAY	BGA1295,36X36,40					BOTTOM										Other Microprocessor ICs	1 mm	S-PBGA-B1295		Not Qualified
AF82801IEM/SLB8P	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40					BOTTOM								308 mA		Other Microprocessor ICs	1 mm	S-PBGA-B676		Not Qualified
AF82801JD/SLG8T	Intel			BALL	676	BGA	SQUARE	PLASTIC	YES		1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40					BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B676		Not Qualified
BD82HM55SLGZS	Intel	MICROPROCESSOR CIRCUIT		UNSPECIFIED	1071	BGA	RECTANGULAR	UNSPECIFIED	YES		1.05,1.5,1.8,3.3,5	GRID ARRAY	BGA1071(UNSPEC)					UNSPECIFIED							CMOS			Bus Controllers				Not Qualified
CYTMA525-49FNI25ZZT	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		BALL	49	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY		1.71 V				BOTTOM			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					R-PBGA-B49
MPC8548VUAUJ	Freescale Semiconductor	SoC		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS		1.1 V	Microprocessors	1 mm	S-CBGA-B783	1	Not Qualified	e2
NQ6702PXHV/SL7X4	Intel			BALL	567	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA567,24X24,50					BOTTOM								2160 mA		Other uPs/uCs/Peripheral ICs	1.27 mm	S-PBGA-B567		Not Qualified
XC7Z030-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS		1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS		1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS		1 V		1 mm	S-PBGA-B676
XC7Z045-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS		1 V		1 mm	S-PBGA-B900
XC7Z045-2FF900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm				31 mm	CMOS		1 V		1 mm	S-PBGA-B900
XC7Z045-2FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS		1 V		1 mm	S-PBGA-B900
XCVE2002-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS		.7 V			S-PBGA-B784			e1
XCVE2302-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS		.8 V		.8 mm	S-PBGA-B784			e1
XCVM1102-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS		.8 V			S-PBGA-B784			e1
XCZU15EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU15EG-L1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS		.72 V			R-PBGA-B1156	4		e1
XCZU17EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU17EG-1FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU17EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU19EG-3FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.9 V			R-PBGA-B1760	4		e1
XCZU19EG-L2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS		.72 V			R-PBGA-B1517	4		e1
XCZU21DR-2FFVD1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU27DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU27DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU28DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU28DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS		.72 V			R-PBGA-B1517	4		e1
XCZU2CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		30	250	19 mm	CMOS		.85 V		.8 mm	R-PBGA-B484	4		e1
XCZU47DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU48DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU49DR-1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU49DR-2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU49DR-L2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS		.72 V			R-PBGA-B1760	4		e1
XCZU4EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	250		CMOS		.85 V			R-PBGA-B784	4		e1
XCZU6CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU7CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU7CG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU7EG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.