BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU7EV-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.97 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

XCZU9CG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XQ7Z045-1RFG676Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

125 Cel

-40 Cel

BOTTOM

3.37 mm

27 mm

NOT SPECIFIED

NOT SPECIFIED

27 mm

CMOS

1 mm

S-PBGA-B676

XQZU7EV-1FFRB900M

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

31 mm

225

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XQZU7EV-L1FFRB900I

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

31 mm

225

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

CN5020-500BG564-SCP-G

Marvell Technology

MICROPROCESSOR CIRCUIT

BALL

564

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B564

DLPC350ZFF

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

419

BGA

SQUARE

PLASTIC/EPOXY

YES

3.465 V

GRID ARRAY

3.135 V

85 Cel

0 Cel

BOTTOM

2.36 mm

23 mm

NOT SPECIFIED

NOT SPECIFIED

23 mm

CMOS

3.3 V

1 mm

S-PBGA-B419

14

GE209HISJ23HM

Advanced Micro Devices

MICROPROCESSOR CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B

GE210JIHJ23HM

Advanced Micro Devices

MICROPROCESSOR CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B

GE415GIBJ44HM

Advanced Micro Devices

MICROPROCESSOR CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B

GE420CIAJ44HM

Advanced Micro Devices

MICROPROCESSOR CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B

M82710-14

Mindspeed Technologies

MICROPROCESSOR CIRCUIT

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

GRID ARRAY

110 Cel

-25 Cel

BOTTOM

CMOS

R-PBGA-B484

SC1100UFH-266

National Semiconductor

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

1.9,3.3

GRID ARRAY

BGA388,26X26,50

TIN LEAD

BOTTOM

30

220

Other Microprocessor ICs

1.27 mm

S-PBGA-B388

3

Not Qualified

e0

XCZU15EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU3EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B625

4

e1

XCZU6CG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9EG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XQ7Z100-1RF900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

BOTTOM

3.44 mm

31 mm

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1 mm

S-PBGA-B900

DRA782BDGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

CC3000YFVT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

126

BGA

SQUARE

PLASTIC/EPOXY

YES

4.8 V

GRID ARRAY

2.7 V

70 Cel

-20 Cel

BOTTOM

CMOS

S-PBGA-B126

DRA787BRGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA786BDGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA786BDGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA782BDGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA756

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

760

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B760

DRA780BDGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA787BRGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

XDM505XXBABF

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY

1.11 V

125 Cel

-40 Cel

BOTTOM

CMOS

1.15 V

S-PBGA-B367

XOMAPL137AZKB3

Texas Instruments

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,1.8/3.3

GRID ARRAY

BGA256,16X16,40

70 Cel

0 Cel

BOTTOM

Other Microprocessor ICs

1 mm

S-PBGA-B256

Not Qualified

TDA3X

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B

DRA781BRGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA780BDGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA746APGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY

TIN SILVER COPPER

BOTTOM

30

250

CMOS

X-PBGA-B760

3

1500 rpm

e1

DRA781BRGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

DRA783BRGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

TCI6630K2LSCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

TCI6630K2LCMS24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

TCI6636K2HBSAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KXAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

DLPC6401ZFF

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

419

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY

1.116 V

55 Cel

0 Cel

BOTTOM

2.36 mm

23 mm

23 mm

CMOS

1.2 V

1 mm

S-PBGA-B419

TCI6636K2HAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HAAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HCAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HASAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KASAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KXAAW

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HBDAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.