BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

AXM5508

Broadcom

MICROPROCESSOR CIRCUIT

BALL

1680

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B1680

LSIFC909

Broadcom

COMMERCIAL

BALL

329

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY

BGA329,23X23,50

70 Cel

0 Cel

BOTTOM

1000 mA

3.3 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B329

Not Qualified

L64388VG

Broadcom

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY

BGA272,20X20,50

BOTTOM

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B272

Not Qualified

LSIFC949X

Broadcom

COMMERCIAL

BALL

544

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,3.3

GRID ARRAY

BGA544,26X26,40

70 Cel

0 Cel

BOTTOM

1100 mA

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B544

Not Qualified

BCM5705

Broadcom

MICROPROCESSOR CIRCUIT

BALL

196

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

NOT SPECIFIED

NOT SPECIFIED

CMOS

R-PBGA-B196

Not Qualified

LSIFC919X

Broadcom

COMMERCIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

GRID ARRAY

BGA456,26X26,50

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B456

Not Qualified

LSIFC929X

Broadcom

COMMERCIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

GRID ARRAY

BGA456,26X26,50

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B456

Not Qualified

BCM5812KFB

Broadcom

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

GRID ARRAY

BGA196,14X14,40

1.71 V

70 Cel

0 Cel

BOTTOM

1.77 mm

15 mm

32

220

15 mm

CMOS

1.8 V

PCI

1 mm

S-PBGA-B196

3

BCM5632

Broadcom

MICROPROCESSOR CIRCUIT

BALL

785

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

X-PBGA-B785

1

Not Qualified

LSIFC929XL

Broadcom

COMMERCIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

GRID ARRAY

BGA456,26X26,50

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B456

Not Qualified

BCM5346

Broadcom

MICROPROCESSOR CIRCUIT

BALL

676

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

X-PBGA-B676

1

Not Qualified

AXM5512

Broadcom

MICROPROCESSOR CIRCUIT

BALL

1680

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B1680

AXM5516

Broadcom

MICROPROCESSOR CIRCUIT

BALL

1680

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B1680

BCM5633

Broadcom

MICROPROCESSOR CIRCUIT

BALL

785

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

X-PBGA-B785

1

Not Qualified

HPFC-5166A

Broadcom

MICROPROCESSOR CIRCUIT

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B388

Not Qualified

T-8110---BAL-DB

Broadcom

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY

3 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.32 mm

27 mm

30

225

27 mm

CMOS

3.3 V

1.27 mm

S-PBGA-B272

Not Qualified

e0

LSIFC929

Broadcom

COMMERCIAL

BALL

329

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA329,23X23,50

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B329

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.