BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVM1402-1LSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY	BGA1596,40X40,36	.676 V	100 Cel	0 Cel			BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V			.92 mm	S-PBGA-B1596
XCZU28DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU21DR-L2FFVD1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1156	4		e1
XCZU25DR-L2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	240		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU21DR-L2FFVD1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.72 V				R-PBGA-B1156	4		e1
XCVM2202-2MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B2197
XCVM1502-2MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B1760
XA7Z030-1FBG484I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40				Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm			30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e1
XCVM2902-2MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B1760
XCVM1502-1MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B1760
XCZU7EG-1LFFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1517,39X39,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4		e1
XCZU25DR-L2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.72 V				R-PBGA-B1156	4		e1
XCVM1402-2MLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel			BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V			.92 mm	S-PBGA-B1596
XCZU5EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B900	4		e1
XCZU9CG-2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.42 mm	31 mm			30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XCVM2302-2MLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B1760
XCZU6CG-2LFFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel			BOTTOM	3.42 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900
XCVM2302-1LSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM								CMOS	.7 V				S-PBGA-B1760
XCZU5EG-1LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU19EG-3FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.71 mm	42.5 mm					42.5 mm	CMOS	.9 V			1 mm	S-PBGA-B1760	4		e1
XCZU17EG-2LFFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1760,42X42,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.71 mm	42.5 mm		0	30	245	42.5 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1760	4		e1
XCZU7EV-3FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.51 mm	40 mm					40 mm	CMOS	.9 V			1 mm	S-PBGA-B1517	4		e1
XCZU3EG-3SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.9 V				S-PBGA-B625	4		e1
XCZU6EG-L1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1156	4		e1
XCZU7EG-1LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCVM1402-2MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel			BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V			.92 mm	S-PBGA-B1596
XCZU7EG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCVM1102-2LLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.7 V				S-PBGA-B784			e1
XCVM1302-2LSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel			BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V			.92 mm	S-PBGA-B1596
XCZU5EG-3FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm			30	245	31 mm	CMOS	.9 V			1 mm	S-PBGA-B900	4		e1
XCZU11EG-1LFFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1517,39X39,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4		e1
XCVM1802-2MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel			BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V			.92 mm	S-PBGA-B1760
XCZU28DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	240		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU28DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU15EG-2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.42 mm	31 mm			30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XCVM2902-3HSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY		.854 V	100 Cel	0 Cel			BOTTOM								CMOS	.88 V				S-PBGA-B1760
XCZU17EG-L1FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1924	4		e1
XCZU17EG-3FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.9 V				R-PBGA-B1760	4		e1
XAZU7EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.97 mm	31 mm		0			31 mm	CMOS	.72 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU17EG-3FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.71 mm	45 mm					45 mm	CMOS	.9 V			1 mm	S-PBGA-B1924	4		e1
XCZU49DR-L1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.72 V				R-PBGA-B1760	4		e1
XCZU48DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU17EG-2LFFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1517,39X39,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4		e1
XCZU21DR-L1FFVD1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1156	4		e1
XCVM1502-1MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B1760
XCZU2EG-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	250		CMOS	.9 V				S-PBGA-B784	4		e1
XCZU7EV-1LFFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1517,39X39,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4		e1
XCZU48DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1156	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.