BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVM1102-1MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM								CMOS	.8 V			S-PBGA-B784		e1
XCZU6CG-2LFFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	31 mm		0	30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU5EV-1LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU6CG-L1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B900	4	e1
XCZU19EG-L1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1517	4	e1
XCZU11EG-1LFFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1156,34X34,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm		0	30	245	35 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4	e1
XCZU15EG-3FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.42 mm	35 mm					35 mm	CMOS	.9 V		1 mm	S-PBGA-B1156	4	e1
XCZU7CG-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU25DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1517	4	e1
XCVM1502-2LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B1760
XCVM2202-1LSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B2197
XCZU19EG-3FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V	GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.9 V			R-PBGA-B1760	4	e1
XCZU2EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	250		CMOS	.85 V			R-PBGA-B784	4	e1
XCVM1302-2MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V		.92 mm	S-PBGA-B1596
XCZU3EG-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	250		CMOS	.9 V			S-PBGA-B784	4	e1
XCZU19EG-3FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V	GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.9 V			R-PBGA-B1924	4	e1
XCZU28DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU11EG-3FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.71 mm	42.5 mm					42.5 mm	CMOS	.9 V		1 mm	S-PBGA-B1760	4	e1
XCZU17EG-3FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V	GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.9 V			R-PBGA-B1760	4	e1
XCZU46DR-1FFVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU4CG-2LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0	30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU25DR-L2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	240		CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU49DR-1FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU17EG-L1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU2EG-L2SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					CMOS	.72 V			R-PBGA-B484	4	e1
XCZU15EG-3FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V	GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.9 V			R-PBGA-B900	4	e1
XCZU7CG-1LFFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1156,34X34,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm		0	30	245	35 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4	e1
XCZU39DR-2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-L2FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.72 V			R-PBGA-B1760	4	e1
XCVM2502-2LLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B2197
XCZU27DR-L2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	240		CMOS	.72 V			R-PBGA-B1517	4	e1
XCVM2302-1MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760
XCVM2202-1MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B2197
XCZU28DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU9EG-2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	31 mm			30	245	31 mm	CMOS	.85 V		1 mm	R-PBGA-B900	4	e1
XCZU47DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.72 V			R-PBGA-B1517	4	e1
XCZU4EV-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B784	4	e1
XCZU11EG-2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm			30	245	35 mm	CMOS	.85 V		1 mm	R-PBGA-B1156	4	e1
XCVM2302-1MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B1760
XCZU4EG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU5EV-3FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm			30	245	31 mm	CMOS	.9 V		1 mm	S-PBGA-B900	4	e1
XCZU17EG-1FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1924	4	e1
XCZU9EG-L2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU27DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU6EG-3FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.42 mm	35 mm					35 mm	CMOS	.9 V		1 mm	S-PBGA-B1156	4	e1
XCVM1802-2HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1760,42X42,36	.854 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.88 V		.92 mm	S-PBGA-B1760
XCVM1502-2HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM								CMOS	.88 V			S-PBGA-B1760
XCZU47DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1517	4	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.