BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU6CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA900,30X30,40	.698 V	100 Cel	-40 Cel			BOTTOM	2.88 mm	31 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				31 mm	CMOS	.72 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU17EG-1FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU9CG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU11EG-L2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU47DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU28DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU17EG-L2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU25DR-L2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU6EG-1LFFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1156,34X34,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.42 mm	35 mm		0	30	245	35 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4		e1
XCVM2202-1MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B2197
XCZU47DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU48DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.72 V				R-PBGA-B1156	4		e1
XCZU7EG-3FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.51 mm	40 mm					40 mm	CMOS	.9 V			1 mm	S-PBGA-B1517	4		e1
XCZU17EG-L2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1760	4		e1
XCZU7CG-2LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0	30	245	31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU28DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU19EG-2LFFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1517,39X39,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4		e1
XCZU9CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA900,30X30,40	.698 V	100 Cel	-40 Cel			BOTTOM	2.88 mm	31 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				31 mm	CMOS	.72 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU27DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU11EG-L2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU2EG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V				R-PBGA-B625	4		e1
XCVM1402-2MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel			BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V			.92 mm	S-PBGA-B1596
XCZU28DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU6CG-2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.42 mm	31 mm			30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XCVM1302-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel	0 Cel			BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V			.92 mm	S-PBGA-B1596
XCVM1102-2LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.7 V				S-PBGA-B784			e1
XC7Z045-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm					27 mm	CMOS	1 V			1 mm	S-PBGA-B676
XCZU17EG-3FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.9 V				R-PBGA-B1517	4		e1
XCZU9CG-L2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1156	4		e1
XCVM1802-1MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel			BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V			.92 mm	S-PBGA-B1760
XCVM2502-1MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B2197
XC7Z030-1FB484I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm					23 mm	CMOS	1 V			1 mm	S-PBGA-B484
XCZU2CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)		30	250		CMOS	.72 V				S-PBGA-B784	4		e1
XC7Z045-2FF900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.35 mm	31 mm					31 mm	CMOS	1 V			1 mm	S-PBGA-B900
XCVM1802-2MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	0 Cel			BOTTOM	3.89 mm	40 mm					40 mm	CMOS	.8 V			.92 mm	S-PBGA-B1760
XCZU4EG-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	245		CMOS	.9 V				R-PBGA-B900	4		e1
XCZU15EG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XA7Z030-1FBG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40		125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm			30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e1
XCVM2502-2LSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM								CMOS	.7 V				S-PBGA-B2197
XCZU17EG-2FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1924	4		e1
XCVM1102-1MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.8 V				S-PBGA-B784			e1
XCZU46DR-L1FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.72 V				R-PBGA-B1760	4		e1
XCVM2502-2MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM								CMOS	.8 V				S-PBGA-B2197
XCZU19EG-L1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1760	4		e1
XCZU5EV-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU29DR-L1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V				R-PBGA-B1760	4		e1
XC7Z030-2FBG484C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	23 mm					23 mm	CMOS	1 V			1 mm	S-PBGA-B484
XCZU4CG-1LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.