BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU17EG-3FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.71 mm	42.5 mm					42.5 mm	CMOS	.9 V		1 mm	S-PBGA-B1760	4	e1
XCZU9CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel		BOTTOM	2.88 mm	31 mm					31 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCVM1502-1MSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	100 Cel	0 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.8 V		.92 mm	S-PBGA-B1369
XCVM1402-2LLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVM1302-2LLIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVM1502-2MSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.8 V		.92 mm	S-PBGA-B1369
XCVM1502-1LSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	100 Cel	0 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.7 V		.92 mm	S-PBGA-B1369
XCVM1502-2LLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.7 V		.92 mm	S-PBGA-B1369
XCVM1502-2HSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.88 V		.92 mm	S-PBGA-B1369
XCVM1502-1LLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.7 V		.92 mm	S-PBGA-B1369
XCVM1502-1MLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.8 V		.92 mm	S-PBGA-B1369
XCVM1502-2LSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.7 V		.92 mm	S-PBGA-B1369
XCVM1502-2MLENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	0 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.8 V		.92 mm	S-PBGA-B1369
XCVM1502-1MSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.8 V		.92 mm	S-PBGA-B1369
XCVM1502-2MLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.8 V		.92 mm	S-PBGA-B1369
XCVM1402-2HSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.88 V		.92 mm	S-PBGA-B1596
XCVM1502-2MSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	0 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.8 V		.92 mm	S-PBGA-B1369
XCVM1502-1LSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.7 V		.92 mm	S-PBGA-B1369
XCVM1502-2LLENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	3.83 mm	35 mm					35 mm	CMOS	.7 V		.92 mm	S-PBGA-B1369
XCVM1302-2HSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.88 V		.92 mm	S-PBGA-B1596
XCZU11EG-1FFVC1156I4524	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU2EG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B784	4	e1
XCZU29DR-2FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU29DR-2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU5CG-1LFBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU49DR-L1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.72 V			R-PBGA-B1760	4	e1
XCVM2202-2MLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B2197
XCVM2302-3HSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM								CMOS	.88 V			S-PBGA-B1760
XCZU3CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B625	4	e1
XC7Z030-3SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	2.44 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XCZU48DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCVM2902-2LLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM								CMOS	.7 V			S-PBGA-B1760
XCZU6EG-2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	35 mm			30	245	35 mm	CMOS	.85 V		1 mm	R-PBGA-B1156	4	e1
XCZU46DR-2FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU6CG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU19EG-L2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU19EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU2CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	250		CMOS	.85 V			R-PBGA-B484	4	e1
XCVM1402-2LSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCZU15EG-1LFFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1156,34X34,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	35 mm		0	30	245	35 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4	e1
XCZU19EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU17EG-1LFFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1760,42X42,40		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm		0	30	245	42.5 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1760	4	e1
XCZU5EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm			30	245	31 mm	CMOS	.85 V		1 mm	R-PBGA-B900	4	e1
XCZU19EG-L1FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1924	4	e1
XCZU11EG-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCVM2502-1MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM								CMOS	.8 V			S-PBGA-B2197
XCZU48DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU19EG-2LFFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1924,44X44,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	45 mm		0	30	245	45 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1924	4	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.