BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVC1352-2HSINSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1369

XCVC1352-1LLINSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVC1352-2LLINSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVC2802-1MLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVC1352-2MLENSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVC1352-2MLENBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1024

XCVC1352-2MLINBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1024

XCVC2802-2MLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVC1352-1LSINBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1024

XCVC2602-1LLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVC1352-2LLINBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1024

XCVC1352-2MLINSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVC1352-1LSENBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1024

XCVC1352-1LSINSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVC2802-1MSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVC2602-1MSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVC1352-2MSENBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1024

XCVC2802-2MLENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVC1352-2MSINBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1024

XCVC1352-1LLINBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1024

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1024

XCVP1002-1LSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP1002-2MLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1702-2LLEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP1052-1MSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1002-1LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP2502-1LLIVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B3340

XCVP1002-2MSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1052-1LSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1002-2LLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVE2802-1LSINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP1052-2LLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP1002-1LSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP2502-1MLIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP1702-2MLIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVE2602-1LSINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP2502-1LLIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP1002-2MSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP2502-2MLIVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B3340

XCVP1052-2LLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVE2802-1LSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP1052-2LSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1002-1LSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1052-1LLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1052-1MLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP1002-1MLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1402-1MSEVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B2197

XCVE2602-2MSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1002-2MSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.