BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVH1542-2LLEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B3697
XCVE2302-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVE2102-2MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B484
XCVE2202-2LLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784	e1
XCVE2802-1LLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2602-1LSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2202-2MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVE2202-2MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVH1582-2MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B4737
XCVE2802-1MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVC2802-1MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVH1582-3HSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B4737
XCVC2602-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2002-2LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B484
XCVC2602-2LLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1352-1MLINSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2802-3HSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B1369
XCVC2802-2MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2802-1LSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1352-1MSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC2602-1MLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1352-2HSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B1024
XCVC1352-1MSENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-2MLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2802-1LLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2802-1MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1352-2MSINSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-2MLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-3HSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B1369
XCVC1352-2LLENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2602-2MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1352-1LSENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2602-1LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2802-2MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-2LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2602-1LSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2602-2MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1352-1MSINSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-1MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1352-2LLENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVC1352-1MLINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-2LSENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2802-1LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1352-2LSENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVC2802-2LLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1352-2MSENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2802-2LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1352-1MSENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1024

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.