BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVP2502-2LLEVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B3340

XCVE2002-2HSISBVA484

Xilinx

MICROPROCESSOR CIRCUIT

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B484

XCVE2202-2LLISFVA784

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

BGA784,28X28,31

.676 V

110 Cel

-40 Cel

BOTTOM

3.66 mm

23 mm

23 mm

CMOS

.7 V

.8 mm

S-PBGA-B784

XCVP1052-1MSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1002-2MSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP1002-1LSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP2502-2MSEVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B3340

XCVE2102-2HSISBVA625

Xilinx

MICROPROCESSOR CIRCUIT

BALL

625

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B625

XCVE2802-2MSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1002-2LLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1052-1MSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1052-2LLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1052-1MSENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1002-1LLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP2502-3HSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

R-PBGA-B5601

XCVP1702-2LSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVE2602-2LLENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP1702-2MLEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP1052-2LSENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVE2602-1MSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVE2802-2MLENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1002-2LLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP2502-2MLIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP1002-1MSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP1702-2MSIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVE2802-1MSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1052-2MLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP2502-2LSEVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B3340

XCVP1702-1LSIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP1002-1LLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVE2602-2MSINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVE2102-2HSISBVA484

Xilinx

MICROPROCESSOR CIRCUIT

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B484

XCVE2002-2LLISBVA625

Xilinx

MICROPROCESSOR CIRCUIT

BALL

625

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B625

XQZU48DR-2FSRG1517I

Xilinx

PROGRAMMABLE RFSoC

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA1517,39X39,40

.808 V

100 Cel

-40 Cel

BOTTOM

4.01 mm

40 mm

40 mm

CMOS

.85 V

1 mm

S-PBGA-B1517

XCVP1552-3HSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B3340

XQZU15EG-L1FFRB1156I

Xilinx

PROGRAMMABLE SoC

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA1156,34X34,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.62 mm

35 mm

40

245

35 mm

CMOS

.85 V

1 mm

S-PBGA-B1156

4

e0

XCVP1552-1LSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B3340

XQZU21DR-1FFRD1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

20

220

CMOS

.85 V

S-PBGA-B1156

4

e0

XQZU7EV-1FFRC1156I

Xilinx

PROGRAMMABLE SoC

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA1156,34X34,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

35 mm

40

245

35 mm

CMOS

.85 V

1 mm

S-PBGA-B1156

4

e0

XQ7Z100-1RF1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

TIN LEAD

BOTTOM

3.53 mm

35 mm

NOT SPECIFIED

NOT SPECIFIED

35 mm

CMOS

1 mm

S-PBGA-B1156

e0

XCVP1552-2LLEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B3340

XCVP1102-3HSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1760

XCVP1402-2MLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XQZU28DR-2FFRG1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1517

4

e0

XCVP1552-1LLIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B3340

XQZU15EG-1FFRB1156M

Xilinx

PROGRAMMABLE SoC

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA1156,34X34,40

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.62 mm

35 mm

40

245

35 mm

CMOS

.85 V

1 mm

S-PBGA-B1156

4

e0

XQZU28DR-L1FFRE1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1156

4

e0

XCVP1402-1MSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.