BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVP1402-3HSEVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

R-PBGA-B2197

XCVE2602-1MSINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1052-2MLEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP1002-2MSENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVE2002-2HSISFVA784

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B784

XCVP1402-1LSEVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B2197

XCVP1052-2MSENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1052-2LLEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1002-2MLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVE2802-2MSINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVE2602-3HSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1369

XCVP2502-2MLEVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B3340

XCVP1052-1MSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP1402-1MLIVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B2197

XCVE2802-2MLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1052-2MSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1002-2LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1702-1LLIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP2502-1LSIVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B3340

XCVP1002-2HSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

R-PBGA-B1369

XCVP1002-1MLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1052-1LSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1702-3HSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

R-PBGA-B5601

XCVP1002-2LSENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP1002-1MSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVE2802-3HSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1369

XCVP1402-1LLIVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B2197

XCVP1002-1LLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP2502-1MSEVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B3340

XCVE2202-2HSISFVA784

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

BGA784,28X28,31

.854 V

110 Cel

-40 Cel

BOTTOM

3.66 mm

23 mm

23 mm

CMOS

.88 V

.8 mm

S-PBGA-B784

XCVP1002-1MSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP2502-1MSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP1052-1LLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP1002-1LSENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP2502-1LSIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP1052-1LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1702-1LSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP2502-2MLEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP2502-3HSEVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

R-PBGA-B3340

XCVP1052-2LLENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP1002-2MLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1702-1MSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP2502-1LSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP2502-1MLIVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B3340

XCVP1402-2MSIVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B2197

XCVP1702-1MSIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP2502-2LSEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP1002-2MLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.