BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVP1402-1LLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1102-1MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1202-1LLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVP1102-2MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XQ7Z030-L2RF676I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS		1 mm	S-PBGA-B676	4	e0
XCVP1402-2MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1552-1LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B3340
XCVP1552-1MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B3340
XQZU28DR-L1FFRG1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			40	245		CMOS	.85 V		S-PBGA-B1517	4	e0
XQZU21DR-2FFRD1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			20	220		CMOS	.85 V		S-PBGA-B1156	4	e0
XQZU5EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XCVH1782-3HSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B4737
XCVC2602-1MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2602-1LSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2102-2LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B484
XCVE2002-1LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B625
XCVC2802-1MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2602-2MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVH1782-2LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B4737
XCVE2102-2MSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B484
XCVE2102-1LSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B625
XCVE2302-1MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY	BGA784,28X28,31	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm			23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2602-1LSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVH1542-2LLELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B4737
XCVH1782-1MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B4737
XCVE2102-1MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B484
XCVE2802-2MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVE2002-1MSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B625
XCVH1542-1LSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B3697
XCVH1782-1LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B4737
XCVH1522-1MSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B3697
XCVE2102-2MLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B625
XCVE2002-1LSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B625
XCVC2602-1LSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2102-1MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B625
XCVE2002-2MLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B625
XCVE2102-2MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B625
XCVE2102-2LLESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B484
XCVE2202-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm			23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVH1582-1MSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B3697
XCVE2002-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						CMOS	.8 V		S-PBGA-B784		e1
XCVE2602-1MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVE2202-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm			23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVH1582-3HSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B3697
XCVE2002-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						CMOS	.8 V		S-PBGA-B784		e1
XCVE2602-2MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVH1522-2MSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B3697
XCVH1542-1MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B4737

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.