BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Terminal Pitch	JESD-30 Code	Qualification	Speed	JESD-609 Code
MPC8548ECVJAQHB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID	29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548ECPXAVHD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548CVJAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783			e2
MPC8548ECVJATGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548EPXAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548EVTAUHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548ECVJAUGA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID	29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8272VRPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel		0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	Not Qualified
MPC8548CVJAUJA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783			e2
MPC8271VRMIB	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel		0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	Not Qualified
MPC8548ECVJATJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548ECPXAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8272ZQPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel		0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	Not Qualified
MPC8272CZQMIB	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA516,26X26,40						BOTTOM										Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	Not Qualified
MPC8548VJAUJB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783			e2
MPC8548EVJAVJA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID	29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548EVJAVHA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548ECVJAVJB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID	29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548CVJAVHB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783			e2
MPC8248CZQPIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA516,26X26,40						BOTTOM										Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	Not Qualified
MPC8548ECVTAUGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548EPXAUGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548EVJAVGA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID	29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8247VRMIB	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel		0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	Not Qualified
MPC8548VJAVHB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783			e2
MPC8548VJAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783			e2
MPC8548EVJAUHA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID	29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8247CVRTIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA516,26X26,40						BOTTOM										Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	Not Qualified
MPC8548EPXAVJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
MPC8548ECVTAVGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		29 mm		29 mm		CMOS		1.1 V			1 mm	S-PBGA-B783
PEB20544E	Infineon Technologies		INDUSTRIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES			2.5,3.3	GRID ARRAY	BGA316,20X20,50		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM							CMOS			Other Microprocessor ICs		1.27 mm	S-PBGA-B316	Not Qualified		e0
PEB3454E	Infineon Technologies		INDUSTRIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES			2.5,3.3	GRID ARRAY	BGA316,20X20,50		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM							CMOS			Other Microprocessor ICs		1.27 mm	S-PBGA-B316	Not Qualified		e0
CY8C20747-24FDXC	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	1.8/5	GRID ARRAY	BGA30,5X6,14	1.71 V	85 Cel	M8C	-40 Cel	TIN SILVER	BOTTOM		16384				1024	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.35 mm	R-PBGA-B30	Not Qualified	25.2 rpm	e2
CP8CTMG240-FNC-01	Infineon Technologies	MICROPROCESSOR CIRCUIT		BALL	30	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			GRID ARRAY		1.71 V					BOTTOM							CMOS		1.8 V				R-PBGA-B30
CY8C20747-24FDXCT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	1.8/5	GRID ARRAY	BGA30,5X6,14	1.71 V	85 Cel	M8C	-40 Cel	TIN SILVER	BOTTOM		16384				1024	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.35 mm	R-PBGA-B30	Not Qualified	25.2 rpm	e2
CY8C20767-24FDXC	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	1.8/5	GRID ARRAY	BGA30,5X6,14	1.71 V	85 Cel	M8C	-40 Cel	TIN SILVER	BOTTOM		32768				2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.35 mm	R-PBGA-B30	Not Qualified	25.2 rpm	e2
SAK-TC277T-64F200S	Infineon Technologies	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	292	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS		3.3 V				S-PBGA-B292			e1
XCVP1052-2HSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY		.854 V	110 Cel		-40 Cel		BOTTOM							CMOS		.88 V				S-PBGA-B1760
XCVP1052-1LLIVSVC2021	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2021	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel		-40 Cel		BOTTOM							CMOS		.7 V				S-PBGA-B2021
XCVP1002-2MLEVSVC2021	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2021	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel		0 Cel		BOTTOM							CMOS		.8 V				S-PBGA-B2021
XCVE2602-2LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel		0 Cel		BOTTOM							CMOS		.7 V				S-PBGA-B1369
XCVE2302-2HSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY	BGA784,28X28,31	.854 V	110 Cel		-40 Cel		BOTTOM	3.66 mm		23 mm		23 mm		CMOS		.88 V			.8 mm	S-PBGA-B784
XCVP1702-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT		BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel		-40 Cel		BOTTOM							CMOS		.8 V				R-PBGA-B5601
XCVP2502-2MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT		BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel		0 Cel		BOTTOM							CMOS		.8 V				R-PBGA-B5601
XCVP1402-1MSIVSVD2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel		-40 Cel		BOTTOM							CMOS		.8 V				R-PBGA-B2197
XCVE2002-2HSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY		.854 V	110 Cel		-40 Cel		BOTTOM							CMOS		.88 V				S-PBGA-B625
XCVP1702-2MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT		BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel		0 Cel		BOTTOM							CMOS		.8 V				R-PBGA-B5601
XCVP1002-1MSENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel		0 Cel		BOTTOM							CMOS		.8 V				R-PBGA-B1369

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.