BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XQ7Z030-1RB484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA484,22X22,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.35 mm	23 mm	30	225	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e0
XQ7Z030-1RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm			31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XCVP1402-1LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	100 Cel	0 Cel			BOTTOM						CMOS	.7 V				S-PBGA-B1760
XQ7Z045-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XCVP1552-2MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B3340
XQZU11EG-L1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
XQZU7EV-1FFRC1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
XCVP1402-1MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B1760
XCVP1552-2MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B3340
XCVP1202-2MLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B2197
XQZU7EV-2FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
XCVP1402-2MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B1760
XCVP1202-1MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B2197
XCVP1202-3HSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY		.854 V	100 Cel	0 Cel			BOTTOM						CMOS	.88 V				S-PBGA-B2197
XQ7Z100-L2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel			BOTTOM	3.44 mm	31 mm	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS				1 mm	S-PBGA-B900
XCVP1202-2MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B2197
XCVP1102-1LSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V				S-PBGA-B1760
XCVP1402-2MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B1760
XCVP1402-2LLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V				S-PBGA-B1760
XCVP1102-2LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V				S-PBGA-B1760
XCVP1552-1MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B3340
XCVP1102-2MLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B1760
XCVP1202-2LLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V				S-PBGA-B2197
XQ7Z030-2RF676I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XCVP1102-1MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B1760
XQ7Z030-1RB484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA484,22X22,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.35 mm	23 mm	30	225	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e0
XQ7Z030-1RF900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.44 mm	31 mm			31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQZU28DR-2FFRE1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM			40	245		CMOS	.85 V				S-PBGA-B1156	4		e0
XQZU5EV-1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XCVP1552-2MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B3340
XQ7Z045-1RF900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.44 mm	31 mm			31 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B900		Not Qualified	e0
XQZU7EV-1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XCVP1102-1MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V				S-PBGA-B1760
XQZU21DR-L1FFRD1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM			20	220		CMOS	.85 V				S-PBGA-B1156	4		e0
XQZU7EV-L1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
XQZU5EV-L1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V			1 mm	S-PBGA-B900	4		e0
XCVP1102-1LLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V				S-PBGA-B1760
XQZU11EG-2FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
XQ7Z030-1RF676I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XQZU29DR-1FFRF1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM			40	245		CMOS	.85 V				S-PBGA-B1760	4		e0
XQZU15EG-2FFRB1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
XQ7Z100-2RF1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	TIN LEAD		BOTTOM	3.53 mm	35 mm	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS				1 mm	S-PBGA-B1156			e0
XQZU11EG-1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
XQ7Z045-2RF676I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40				TIN LEAD	N	BOTTOM	3.37 mm	27 mm			27 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676		Not Qualified	e0
XCZU25DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM			30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU17EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU9CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel			BOTTOM	2.88 mm	31 mm			31 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU6CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel			BOTTOM	2.88 mm	31 mm			31 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.