BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVE2302-2LLISFVA784

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

BGA784,28X28,31

.676 V

110 Cel

-40 Cel

BOTTOM

3.66 mm

23 mm

23 mm

CMOS

.7 V

.8 mm

S-PBGA-B784

XCVP1002-1MSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVE2602-1LSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP1002-2MSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1052-1LSENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP1402-2MLIVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B2197

XCVP1052-2MSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVE2002-2LLISBVA484

Xilinx

MICROPROCESSOR CIRCUIT

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B484

XCVP1402-1LSIVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B2197

XCVP1052-1MLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XQZU29DR-L1FFRF1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1760

4

e0

XQ7Z030-2RF900I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA900,30X30,40

TIN LEAD

N

BOTTOM

3.44 mm

31 mm

31 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B900

Not Qualified

e0

XCVP1202-2LSEVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2197

XQZU15EG-1FFRC900M

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.62 mm

31 mm

40

245

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XQZU28DR-1FFRE1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1156

4

e0

XCVP1202-1LSEVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2197

XQZU29DR-1FFRF1760M

Xilinx

MICROPROCESSOR CIRCUIT

MILITARY

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1760

4

e0

XQ7Z030-2RB484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA484,22X22,40

100 Cel

-40 Cel

TIN LEAD

N

BOTTOM

3.35 mm

23 mm

30

225

23 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B484

4

Not Qualified

e0

XQZU15EG-L1FFRC900I

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.62 mm

31 mm

40

245

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XCVP1102-2LLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XQ7Z030-L2RB484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

TIN LEAD

BOTTOM

3.35 mm

23 mm

30

225

23 mm

CMOS

1 mm

S-PBGA-B484

4

e0

XCVP1552-2MSIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B3340

XCVP1102-1LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1102-2MLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XQZU15EG-1FFRB1156I

Xilinx

PROGRAMMABLE SoC

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA1156,34X34,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.62 mm

35 mm

40

245

35 mm

CMOS

.85 V

1 mm

S-PBGA-B1156

4

e0

XCVP1402-2LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1202-1LSIVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2197

XQZU28DR-1FFRG1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1517

4

e0

XQZU7EV-2FFRB900I

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

31 mm

225

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XCVP1202-2MSEVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2197

XCVP1202-1MLIVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2197

XCVP1402-1LSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XQZU15EG-1FFRC900I

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.62 mm

31 mm

40

245

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XQZU28DR-1FFRG1517M

Xilinx

MICROPROCESSOR CIRCUIT

MILITARY

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1517

4

e0

XQ7Z045-2RF900I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA900,30X30,40

TIN LEAD

N

BOTTOM

3.44 mm

31 mm

31 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B900

Not Qualified

e0

XQZU5EV-2FFRB900I

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

31 mm

225

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XCVP1402-1MLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XQZU21DR-1FFRD1156M

Xilinx

MICROPROCESSOR CIRCUIT

MILITARY

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

20

220

CMOS

.85 V

S-PBGA-B1156

4

e0

XQZU29DR-2FFRF1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1760

4

e0

XCVP1202-1MSEVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2197

XCVP1552-1MSIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B3340

XCVP1202-2MLIVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2197

XCVP1552-2LSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B3340

XCVP1402-3HSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

100 Cel

0 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1760

XQZU15EG-2FFRC900I

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.62 mm

31 mm

40

245

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XQ7Z100-L2RF1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

TIN LEAD

BOTTOM

3.53 mm

35 mm

NOT SPECIFIED

NOT SPECIFIED

35 mm

CMOS

1 mm

S-PBGA-B1156

e0

XQ7Z045-1RF900I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA900,30X30,40

TIN LEAD

N

BOTTOM

3.44 mm

31 mm

31 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B900

Not Qualified

e0

XCVP1102-2MSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.