BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVP1002-1MSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1402-2MSEVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B2197

XCVE2102-2LLISBVA625

Xilinx

MICROPROCESSOR CIRCUIT

BALL

625

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B625

XCVP1052-2LLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1052-2MSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVE2802-1MLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1052-2MSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1002-2HSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1760

XCVP1002-2LLENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVP1052-2MLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVE2102-2HSISFVA784

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B784

XCVE2102-2LLISFVA784

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B784

XCVP1002-2HSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B2021

XCVP1052-1MLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVE2802-2LSENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP1402-2MLEVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B2197

XCVE2802-1MSINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1052-1MSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVP2502-2LLEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B5601

XCVP2502-1MSIVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B3340

XCVE2002-2LLISFVA784

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B784

XCVP2502-1MSIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVE2102-2LLISBVA484

Xilinx

MICROPROCESSOR CIRCUIT

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B484

XCVP1052-2MLINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1052-2MLENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1052-2MLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1052-2HSIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B2021

XCVE2602-1MLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVE2802-2LLENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP2502-1LSEVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B3340

XCVP1002-2MLENFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B1369

XCVP1052-1LSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1002-2LSEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP2502-2MSIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B5601

XCVP1002-1MLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B2021

XCVE2602-2MLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1052-2MSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1402-2LSEVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B2197

XCVP1002-2LLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1052-2LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1002-2LLEVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVE2602-1LLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

XCVP2502-2MSIVSVB3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

R-PBGA-B3340

XCVE2602-2MLENSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1369

XCVP1052-2HSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

R-PBGA-B1369

XCVP1402-2LLEVSVD2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B2197

XCVP1052-1LSINFVI1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

R-PBGA-B1369

XCVE2802-1LLINSVH1369

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1369

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1369

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.