BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVM1802-2MLEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

BGA1760,42X42,36

.775 V

110 Cel

0 Cel

BOTTOM

3.89 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1760

XCZU17EG-L2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU5CG-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU19EG-1LFFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA1760,42X42,40

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

0

30

245

42.5 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B1760

4

e1

XA7Z030-1FBV484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY

100 Cel

-40 Cel

BOTTOM

CMOS

S-PBGA-B484

XCZU3CG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XCVM2302-2MSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCZU17EG-2LFFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA1760,42X42,40

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

0

30

245

42.5 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B1760

4

e1

XCVM1802-2LLEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

BGA1760,42X42,36

.676 V

110 Cel

0 Cel

BOTTOM

3.89 mm

40 mm

40 mm

CMOS

.7 V

.92 mm

S-PBGA-B1760

XCZU5CG-2LFBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA900,30X30,40

110 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.88 mm

31 mm

0

31 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B900

4

e1

XCZU47DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EG-1LFFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA1156,34X34,40

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

35 mm

0

30

245

35 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B1156

4

e1

XCZU25DR-1FSVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU4EG-1LFBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA900,30X30,40

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.88 mm

31 mm

0

31 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B900

4

e1

XCZU9CG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCVM2502-1LLIVSVC2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2197

XCZU7EV-1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU19EG-1LFFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA1517,39X39,40

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

40 mm

0

30

245

40 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B1517

4

e1

XCZU7CG-2LFFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA1156,34X34,40

100 Cel

-40 Cel

BOTTOM

3.51 mm

35 mm

0

35 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B1156

XCZU3EG-2SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B625

4

e1

XCZU7EG-2LFFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA1517,39X39,40

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

40 mm

0

30

245

40 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B1517

4

e1

XCZU17EG-2FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU2EG-2SBVA484I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

CMOS

.85 V

R-PBGA-B484

4

e1

XCZU47DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1156

4

e1

XCVM1802-1LSEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

BGA1760,42X42,36

.676 V

100 Cel

0 Cel

BOTTOM

3.89 mm

40 mm

40 mm

CMOS

.7 V

.92 mm

S-PBGA-B1760

XCZU5EV-3FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B900

4

e1

XCZU2CG-2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.43 mm

21 mm

30

250

21 mm

CMOS

.85 V

.8 mm

R-PBGA-B625

4

e1

XCZU9CG-2LFFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA900,30X30,40

100 Cel

-40 Cel

BOTTOM

3.42 mm

31 mm

0

31 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B900

R-IN32M3-CL

Renesas Electronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY

.9 V

85 Cel

-40 Cel

BOTTOM

1.95 mm

19 mm

ALSO OPERATES AT 3.3V

19 mm

CMOS

1 V

1 mm

S-PBGA-B324

72T6360L7-5BB

Renesas Electronics

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

2.375 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

30

225

CMOS

2.5 V

S-PBGA-B324

3

Not Qualified

e0

72T6360L7-5BBI

Renesas Electronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

2.375 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

30

225

CMOS

2.5 V

S-PBGA-B324

3

Not Qualified

e0

HJ935050

Renesas Electronics

MICROPROCESSOR CIRCUIT

BALL

353

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

2.68 mm

31 mm

31 mm

CMOS

1.9 V

1.27 mm

S-PBGA-B353

Not Qualified

e1

VRC5074

Renesas Electronics

INDUSTRIAL

BALL

500

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY

BGA500,30X30,50

85 Cel

-40 Cel

BOTTOM

CMOS

.8 mA

3.3 V

Other Microprocessor ICs

1.27 mm

S-PBGA-B500

Not Qualified

IDT72T6360L7.5BBGI

Renesas Electronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

2.375 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.97 mm

19 mm

19 mm

CMOS

2.5 V

1 mm

S-PBGA-B324

3

Not Qualified

e1

89TSF552BL

Renesas Electronics

MICROPROCESSOR CIRCUIT

OTHER

BALL

960

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

GRID ARRAY

1.71 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

3.29 mm

35 mm

35 mm

CMOS

1.8 V

S-PBGA-B960

Not Qualified

e0

72T6360L6BB

Renesas Electronics

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

2.375 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.97 mm

19 mm

30

225

19 mm

CMOS

2.5 V

1 mm

S-PBGA-B324

3

Not Qualified

e0

R-IN32M3-EC

Renesas Electronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY

.9 V

85 Cel

-40 Cel

BOTTOM

1.95 mm

19 mm

ALSO OPERATES AT 3.3V

19 mm

CMOS

1 V

1 mm

S-PBGA-B324

UPD65977S1-XXX-B6

Renesas Electronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY

3 V

85 Cel

-40 Cel

BOTTOM

2.2 mm

27 mm

27 mm

CMOS

3.3 V

1.27 mm

S-PBGA-B256

89TSF553BL

Renesas Electronics

MICROPROCESSOR CIRCUIT

OTHER

BALL

960

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

GRID ARRAY

1.71 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

3.29 mm

35 mm

35 mm

CMOS

1.8 V

S-PBGA-B960

Not Qualified

e0

72T6360L7.5BBGI

Renesas Electronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

2.375 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.97 mm

19 mm

19 mm

CMOS

2.5 V

1 mm

S-PBGA-B324

3

Not Qualified

e1

72T6360L7.5BBG

Renesas Electronics

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

2.375 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.97 mm

19 mm

19 mm

CMOS

2.5 V

1 mm

S-PBGA-B324

3

Not Qualified

e1

HJ935060

Renesas Electronics

MICROPROCESSOR CIRCUIT

BALL

353

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

2.68 mm

31 mm

31 mm

CMOS

1.9 V

1.27 mm

S-PBGA-B353

Not Qualified

e1

UPD65948S1-068

Renesas Electronics

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY

BGA256,20X20,50

70 Cel

0 Cel

BOTTOM

CMOS

.3 mA

3.3 V

Other Microprocessor ICs

1.27 mm

S-PBGA-B256

Not Qualified

IDT72T6360L7.5BBG

Renesas Electronics

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

2.375 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.97 mm

19 mm

19 mm

CMOS

2.5 V

1 mm

S-PBGA-B324

3

Not Qualified

e1

PCI9656-AA66BI

Broadcom

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA272,20X20,50

85 Cel

-40 Cel

TIN LEAD

BOTTOM

ALSO REQUIRES 3.3V SUPPLY FOR I/O

CMOS

.05 mA

2.5 V

Bus Controllers

1.27 mm

S-PBGA-B272

Not Qualified

e0

BCM53724

Broadcom

MICROPROCESSOR CIRCUIT

BALL

1152

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B1152

Not Qualified

BCM5820KTB

Broadcom

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

GRID ARRAY

BGA256,20X20,50

2.375 V

70 Cel

0 Cel

BOTTOM

1.75 mm

27 mm

64

90 MHz

27 mm

CMOS

2.5 V

PCI

1.27 mm

S-PBGA-B256

LSIFC919

Broadcom

COMMERCIAL

BALL

329

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA329,23X23,50

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B329

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.