BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU7EG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU11EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU11EG-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS	.72 V			R-PBGA-B1156	4		e1
XCZU2CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B625	4		e1
10AS016E4F29I3LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	-40 Cel			BOTTOM	3.35 mm	29 mm				29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
XCZU27DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU27DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
CSR8675C-ICXT-R	Qualcomm	MICROPROCESSOR CIRCUIT		BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY	YES				GRID ARRAY							BOTTOM							CMOS				X-PBGA-B
XCVM1402-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel	0 Cel			BOTTOM	3.75 mm	37.5 mm				37.5 mm	CMOS	.8 V		.92 mm	S-PBGA-B1596
XQZU11EG-1FFRC1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm		40	245	35 mm	CMOS	.85 V		1 mm	S-PBGA-B1156	4		e0
SA8155P	Qualcomm	SoC		BALL	989	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY			105 Cel	-40 Cel			BOTTOM							CMOS				S-PBGA-B989
XCZU28DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.72 V			R-PBGA-B1517	4		e1
XCZU29DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4		e1
10AS016E4F27E3SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm				27 mm	TSMC	.9 V		1 mm	S-PBGA-B672
XCZU15EG-3FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.9 V			R-PBGA-B1156	4		e1
XCZU3CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	30	250		CMOS	.72 V			S-PBGA-B784	4		e1
XCZU48DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU49DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU6CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
10AS016E3F27E2SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			27 mm	TSMC	.9 V		1 mm	S-PBGA-B672
XCZU17EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.71 mm	42.5 mm		30	245	42.5 mm	CMOS	.85 V		1 mm	R-PBGA-B1760	4		e1
XCZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B784	4		e1
XCZU47DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU48DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU9EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XQZU28DR-1FFRE1156M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM				40	245		CMOS	.85 V			S-PBGA-B1156	4		e0
10AS027E2F27E2LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			27 mm	TSMC	.9 V		1 mm	S-PBGA-B672
10AS027E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
XCZU19EG-1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU47DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU49DR-1FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B784	4		e1
XCZU6CG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XCZU7EG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XQ7Z030-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm		30	225	27 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B676	4	Not Qualified	e0
XQ7Z045-1RF676I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40				TIN LEAD	N	BOTTOM	3.37 mm	27 mm				27 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B676		Not Qualified	e0
10AS016E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm				29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
10AS048E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
SC2200UCL-266	National Semiconductor			BALL	432	BGA	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	GRID ARRAY	BGA432,31X31,50				TIN LEAD		BOTTOM				30	220		CMOS		Other Microprocessor ICs	1.27 mm	S-PBGA-B432	3	Not Qualified	e0
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XCZU19EG-1FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU27DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU27DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU2EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B784	4		e1
XCZU3EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B784	4		e1
XCZU47DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU48DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.