BGA Other Function uPs,uCs & Peripheral ICs 1,985

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
XCZU27DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU27DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	240		CMOS	.72 V				R-PBGA-B1156	4		e1
XCZU4EG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU7CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU7CG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU7CG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU7CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.97 mm	31 mm				30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XQ7Z100-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel		BOTTOM	3.44 mm	31 mm				NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS				1 mm	S-PBGA-B900
80312	Intel	MICROPROCESSOR CIRCUIT		BALL	540	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY		3 V				BOTTOM	4.1 mm	42.5 mm						42.5 mm	CMOS	3.3 V			1.27 mm	S-PBGA-B540		Not Qualified
A2F200M3F-FG484	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V		GRID ARRAY		1.425 V	85 Cel	0 Cel	TIN LEAD	BOTTOM									CMOS	1.5 V				S-PBGA-B484	3
TCI6630K2LSCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V				S-PBGA-B900	4		e1
TCI6630K2LSCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V				S-PBGA-B900	4		e1
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm						23 mm	CMOS	1 V			1 mm	S-PBGA-B484
XCZU17EG-2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm				30	245	42.5 mm	CMOS	.85 V			1 mm	R-PBGA-B1760	4		e1
XCZU27DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU2CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V				R-PBGA-B484	4		e1
XCZU2CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V				R-PBGA-B625	4		e1
XCZU2EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM									CMOS	.85 V				R-PBGA-B484	4		e1
XCZU5EG-1SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.85 V			.8 mm	R-PBGA-B784	4		e1
XCZU7CG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU7EV-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU9EG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V				R-PBGA-B900	4		e1
10AS048H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm						35 mm	TSMC	.9 V			1 mm	S-PBGA-B1152
10AS066H2F34I1HG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1152,34X34,40		100 Cel	-40 Cel		BOTTOM	3.35 mm	35 mm						35 mm	TSMC				1 mm	S-PBGA-B1152
A2F200M3F-1FG484I	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V		GRID ARRAY		1.425 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM									CMOS	1.5 V				S-PBGA-B484	3
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel		BOTTOM	2.42 mm	27 mm		16	20 MHz			27 mm	CMOS	1.15 V		I2C; SPI; UART; USB	1 mm	S-PBGA-B516				9
MPC8548ECHXAQG	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.38 mm	29 mm				40	260	29 mm	CMOS	1.1 V	Microprocessors		1 mm	S-CBGA-B783	1	Not Qualified	e0
MPC8548ECHXAUJ	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.38 mm	29 mm				40	260	29 mm	CMOS	1.1 V	Microprocessors		1 mm	S-CBGA-B783	1	Not Qualified	e0
XCZU11EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU11EG-1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1760	4		e1
XCZU11EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU11EG-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.9 V				R-PBGA-B1156	4		e1
XCZU19EG-2FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1924	4		e1
XCZU3CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250		CMOS	.85 V				R-PBGA-B484	4		e1
XCZU3CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V				R-PBGA-B484	4		e1
XCZU4CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V				R-PBGA-B900	4		e1
XCZU4EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V				R-PBGA-B784	4		e1
XCZU4EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V				R-PBGA-B900	4		e1
XCZU5CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU5CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS	.85 V				S-PBGA-B784	4		e1
XCZU5CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V				S-PBGA-B784	4		e1
XCZU5EG-1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm				30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XCZU5EG-3SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY	BGA784,28X28,32	.873 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.9 V			.8 mm	S-PBGA-B784	4		e1
XCZU5EG-L1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY	BGA784,28X28,32	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250	23 mm	CMOS	.72 V			.8 mm	R-PBGA-B784	4		e1
XCZU5EG-L2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY	BGA784,28X28,32	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250	23 mm	CMOS	.72 V			.8 mm	R-PBGA-B784	4		e1
XCZU5EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS	.85 V				R-PBGA-B784	4		e1
XCZU7EV-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V				R-PBGA-B1517	4		e1
10AS032H3F35E2SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY					35 mm	TSMC	.9 V			1 mm	S-PBGA-B1152

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.