LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MCIMX353DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX357CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX357DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX6X1CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm		17 mm				40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3			e1
MCIMX6X1EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm		17 mm				40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3			e1
MCIMX6X3EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		14 mm				40	260	14 mm	CMOS				.65 mm		S-PBGA-B400	3			e1
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm	CMOS				.8 mm		S-PBGA-B289	3
MPFS095T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel			BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm		S-PBGA-B536
OMAPL138EZWTA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
VCBU65WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS	1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS	1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm		19 mm						19 mm	CMOS	1 V			.8 mm		S-PBGA-B485
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	1 V			.8 mm		S-PBGA-B625	3			e1
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
MCIMX257DJM4A,557	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	70 Cel	-20 Cel			BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY					17 mm	CMOS	1.45 V			.8 mm		S-PBGA-B400
MCIMX286DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm		S-PBGA-B289	3
MCIMX6D5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6U5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1
MCIMX6X2EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm		17 mm				40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3			e1
MCIMX6X4AVM08AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3			e1
MCIMX6Y2CVM05AAR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm		14 mm				40	260	14 mm	CMOS				.8 mm		S-PBGA-B289	3			e1
MIMXRT106ACVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel			BOTTOM	1.43 mm		10 mm				40	260	10 mm	CMOS				.65 mm		S-PBGA-B196	3
MPFS095TL-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel			BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm		S-PBGA-B536
MPFS095TS-FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	-40 Cel			BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm		S-PBGA-B536
MTFC64GJDDN-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		14 mm	IT ALSO OPERATES AT 3.3 VOLTS					18 mm	CMOS	1.8 V			.5 mm		R-PBGA-B169				e1
OMAPL138BZWTRB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS	1.3 V			.8 mm		S-PBGA-B361	3			e1
OMAPL138CZWTA3RW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
TMS320DM355DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM369ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm		32		30	260	13 mm	CMOS		Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMSDM6446AZWT-COM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
TNETV6446AINZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm		S-PBGA-B289	3
MCIMX512CJM6CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MPFS250T-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel			BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm		S-PBGA-B536
TMS320DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS	1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
MCIMX513DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX27LVOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ			40	260	17 mm	CMOS	1.45 V			.65 mm		S-PBGA-B404	3	Not Qualified		e1
MCIMX515CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
MCIMX253DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm	CMOS	1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX287CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm		S-PBGA-B289	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm	CMOS				.8 mm		S-PBGA-B289	3
XA7Z020-1CLG400I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32				Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm		17 mm				30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs		.8 mm		S-PBGA-B400	3	Not Qualified		e1
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm		17 mm				30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs		.8 mm		S-PBGA-B400	3	Not Qualified		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.