LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ADSP-21584BBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-SC573-BCZENG

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

GRID ARRAY, LOW PROFILE, FINE PITCH

3.13 V

70 Cel

0 Cel

BOTTOM

1.5 mm

17 mm

17 mm

CMOS

3.3 V

.8 mm

S-PBGA-B400

ADSP-SC584BBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-SC583KBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-SC584CBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-21584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADUCM350BBCZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

120

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE, FINE PITCH

2.5 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.35 mm

8 mm

30

260

8 mm

CMOS

3 V

.5 mm

S-PBGA-B120

3

e1

ADSP-SC583CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-21584CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-SC587KBCZ-5B

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-SC584KBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-SC584KBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-21583KBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-SC583BBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-SC582BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-21573-BCZENG

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

GRID ARRAY, LOW PROFILE, FINE PITCH

3.13 V

70 Cel

0 Cel

BOTTOM

1.5 mm

17 mm

17 mm

CMOS

3.3 V

.8 mm

S-PBGA-B400

ADSP-21584KBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-SC582CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

MAX78002GXE+

Analog Devices

MICROPROCESSOR, RISC

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.21 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

.9 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

30

260

12 mm

CMOS

1.1 V

.8 mm

S-PBGA-B144

3

e1

MAX78000EXG+

Analog Devices

SoC

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.21 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA81,9X9,32

.9 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8 mm

30

260

8 mm

CMOS

1.1 V

.8 mm

S-PBGA-B81

3

e1

STA2058EXTR

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

GRID ARRAY, LOW PROFILE, FINE PITCH

2.97 V

85 Cel

-40 Cel

BOTTOM

1.7 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.8 mm

S-PBGA-B144

Not Qualified

SPEAR-09-H042

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, LOW PROFILE, FINE PITCH

85 Cel

-40 Cel

BOTTOM

1.7 mm

15 mm

IT ALSO REQUIRES 3.3V SUPPLY

15 mm

CMOS

1.2 V

.8 mm

S-PBGA-B289

Not Qualified

STA1085POCTR

STMicroelectronics

SoC

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

-40 Cel

BOTTOM

1.7 mm

16 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

CMOS

.8 mm

S-PBGA-B361

STA2058EXATR

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

GRID ARRAY, LOW PROFILE, FINE PITCH

2.97 V

85 Cel

-40 Cel

BOTTOM

1.7 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.8 mm

S-PBGA-B144

Not Qualified

STA2058EX

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

GRID ARRAY, LOW PROFILE, FINE PITCH

2.97 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

10 mm

30

260

10 mm

CMOS

3.3 V

.8 mm

S-PBGA-B144

3

Not Qualified

e1

STA2058EXA

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

GRID ARRAY, LOW PROFILE, FINE PITCH

2.97 V

85 Cel

-40 Cel

BOTTOM

1.7 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.8 mm

S-PBGA-B144

Not Qualified

STA1085HOCTR

STMicroelectronics

SoC

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

-40 Cel

BOTTOM

1.7 mm

16 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

CMOS

.8 mm

S-PBGA-B361

STV0987A/TR

STMicroelectronics

MICROPROCESSOR CIRCUIT

OTHER

BALL

104

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

70 Cel

-25 Cel

BOTTOM

1.31 mm

5 mm

5 mm

CMOS

1.8 V

.4 mm

S-PBGA-B104

STV0987/TR

STMicroelectronics

MICROPROCESSOR CIRCUIT

OTHER

BALL

104

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

70 Cel

-25 Cel

BOTTOM

1.31 mm

5 mm

5 mm

CMOS

1.8 V

.4 mm

S-PBGA-B104

PCIMX516AJM6C

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

529

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.175 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

19 mm

40

260

19 mm

CMOS

1.225 V

.8 mm

S-PBGA-B529

3

Not Qualified

e1

935317691557

NXP Semiconductors

SYSTEM ON CHIP

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MC9328MXLDVM20

NXP Semiconductors

SoC

BALL

256

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA256,16X16,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

14 mm

40

260

14 mm

CMOS

1.8 V

.8 mm

S-PBGA-B256

3

MC9328MXLVM15R2

NXP Semiconductors

SoC

BALL

256

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA256,16X16,32

1.7 V

70 Cel

0 Cel

BOTTOM

1.6 mm

14 mm

40

260

14 mm

CMOS

1.8 V

.8 mm

S-PBGA-B256

3

MC9328MXLVP20R2

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

13 mm

40

260

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

3

e1

MC9328MXLDVP20

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

13 mm

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

MC9328MXLVM20R2

NXP Semiconductors

SoC

BALL

256

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA256,16X16,32

1.7 V

70 Cel

0 Cel

BOTTOM

1.6 mm

14 mm

14 mm

CMOS

1.8 V

.8 mm

S-PBGA-B256

935354192557

NXP Semiconductors

SYSTEM ON CHIP

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MC9328MXLDVP15

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

13 mm

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

MC9328MXLDVP15R2

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

13 mm

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

MC9328MXLCVP15

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

13 mm

40

260

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

3

e1

935314935557

NXP Semiconductors

SYSTEM ON CHIP

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MC9328MXLCVM15R2

NXP Semiconductors

SoC

BALL

256

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA256,16X16,32

1.7 V

85 Cel

-40 Cel

BOTTOM

1.6 mm

14 mm

40

260

14 mm

CMOS

1.8 V

.8 mm

S-PBGA-B256

3

MC9328MXLDVP20R2

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

13 mm

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

935311754518

NXP Semiconductors

SYSTEM ON CHIP

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

935354193557

NXP Semiconductors

SYSTEM ON CHIP

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MC9328MXLDVM15R2

NXP Semiconductors

SoC

BALL

256

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA256,16X16,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

14 mm

14 mm

CMOS

1.8 V

.8 mm

S-PBGA-B256

935312063557

NXP Semiconductors

SYSTEM ON CHIP

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MC9328MXLVP15R2

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

13 mm

40

260

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

3

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.