LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
TMS320DM365SZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V				BOTTOM	1.3 mm	8192	13 mm						13 mm	CMOS	1.35 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
SCANSTA101SMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		7 mm		32		30	260	7 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	4	Not Qualified		e1
OMAPL138ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V				BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm	CMOS	1.3 V			.65 mm		S-PBGA-B361
AM4377BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	1.325 V			.65 mm		S-PBGA-B491	3			e1
TMS320DM355DZCE27J	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
OMAP3503DCUSA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.8 V	Graphics Processors		.8 mm		S-PBGA-B423	4	Not Qualified		e1
SCANSTA101SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		7 mm		32		30	260	7 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	4	Not Qualified		e1
TMS320DM365ZCEM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.71 V	85 Cel	0 Cel		BOTTOM	1.3 mm		13 mm	ALSO REQIRIES 3.3 V SUPPLY					13 mm	CMOS	1.8 V			.65 mm		S-PBGA-B338
66AK2G12ABYT100	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	1 V			.8 mm		S-PBGA-B625	3			e1
DM368ZCEDZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm				30	260	13 mm	CMOS	1.35 V			.65 mm		S-PBGA-B338	3			e1
OMAPL132EZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
TMS320DM355DZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
SCANSTA112SM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	1.5 mm		10 mm		0		NOT SPECIFIED	235	10 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B100	3	Not Qualified		e0
TMS320DM365ZCE21	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
OMAP3503DCUS72	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	90 Cel	0 Cel		BOTTOM	1.4 mm		16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1.8 V	Graphics Processors		.8 mm		S-PBGA-B423		Not Qualified
DM368ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm				30	260	13 mm	CMOS	1.35 V			.65 mm		S-PBGA-B338	3			e1
66AK2G12ABYA100E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	1 V			.8 mm		S-PBGA-B625	3			e1
TMS320DM355ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355CZCEA13	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V			TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355ZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6441AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm	CMOS	1.05 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
OMAPL138EZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS	1.3 V			.8 mm		S-PBGA-B361	3			e1
AM4377BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	1.26 V			.65 mm		S-PBGA-B491	3			e1
DM355SDZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V			TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6443BZWTB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
OMAPL132BZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V			TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP			30	260	16 mm	CMOS	1 V	Other Microprocessor ICs		.8 mm		S-PBGA-B361	3	Not Qualified		e1
TMS320DM335ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B337	3	Not Qualified		e1
SCANSTA111SMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		7 mm				30	260	7 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	4	Not Qualified		e1
TMS320DM335DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM369ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32		30	260	13 mm	CMOS		Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
ADSP-SC583KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC587KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-21583-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm		19 mm						19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B349
ADSP-21584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC589BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-21584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC584-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm		19 mm						19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B349
ADSP-SC587BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-21583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC584BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC589BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC582KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADUCM350BBCZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.35 mm		8 mm				30	260	8 mm	CMOS	3 V			.5 mm		S-PBGA-B120	3			e1
ADSP-SC584CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.