LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX27VOP4-LF	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel	-20 Cel		BOTTOM	1.4 mm	17 mm	ALSO OPERATES 1.3V AT 266MHZ			17 mm	CMOS	1.45 V		.65 mm	S-PBGA-B404
MCIMX6Q5EZK08AD	NXP Semiconductors	SoC	OTHER	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm		40	260	12 mm	CMOS	1.4 V		.4 mm	S-PBGA-B569	3		e1
MCIMX351AVM4BR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX507CVM1BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.2 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.275 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6U6AVM08ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX507CVM1B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.2 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.275 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX513CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX356AVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6Y7DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX355AJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6Y1CVK05AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6Q5EYM12AE	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX280CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B289	3	Not Qualified	e1
MCIMX6G3CVK05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6Q4AVT08AE	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.225 V	125 Cel	-40 Cel		BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX281AVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX6X2CVN08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6D5EZK08AD	NXP Semiconductors	SoC	OTHER	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm		40	260	12 mm	CMOS	1.4 V		.4 mm	S-PBGA-B569	3		e1
MCIMX6S6AVM08ABR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	21 mm		40	260	21 mm	CMOS		Graphics Processors	.8 mm	S-PBGA-B624	3	Not Qualified	e1
MCIMX280CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX351AJQ4C	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.22 V	85 Cel	-40 Cel		BOTTOM	1.6 mm	17 mm				17 mm	CMOS			.8 mm	S-PBGA-B400		Not Qualified
MCIMX6X1CVO08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm	24MHZ NOMINAL FREQUENCY AVAILABLE	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX6U6AVM08ABR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	21 mm		40	260	21 mm	CMOS		Graphics Processors	.8 mm	S-PBGA-B624	3	Not Qualified	e1
MCIMX6G1AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX27LVJP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel	-20 Cel		BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS	1.45 V	Microprocessors	.65 mm	S-PBGA-B404		Not Qualified
MCIMX355AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX27LMJP4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.54 mm	19 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	19 mm	CMOS	1.45 V		.8 mm	S-PBGA-B473	3	Not Qualified	e1
MCIMX6X3EVK10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS			.65 mm	S-PBGA-B400	3		e1
MCIMX257CJN4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	347	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA347,22X22,20	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	12 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	12 mm	CMOS	1.45 V	Microprocessors	.5 mm	S-PBGA-B347	3	Not Qualified	e1
MCIMX31LCJKN5D	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	457	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA457,26X26,20	1.52 V	85 Cel	-40 Cel		BOTTOM	1.3 mm	14 mm		NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		Microprocessors	.5 mm	S-PBGA-B457		Not Qualified
MCIMX502EVM8B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.05 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6U5DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MIMX8MN4DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3		e2
MCIMX515DVK8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA527,25X25,20	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	13 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	13 mm	CMOS	1.1 V	Graphics Processors	.5 mm	S-PBGA-B625	3	Not Qualified	e1
MCIMX6Y1DVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e1
MIMX8MM5DVTLZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3		e2
MCIMX514AJM6CR2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX515CJM6CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX516AJM6CR2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX255AJM4AR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6G2CVK05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX514AJM6C	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX6U4AVM08ABR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	21 mm		40	260	21 mm	CMOS		Graphics Processors	.8 mm	S-PBGA-B624	3	Not Qualified	e1
MCIMX355AVM5BR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3		e1
MIMXRT105SCVL5B	NXP Semiconductors	SYSTEM ON CHIP		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	10 mm				10 mm	CMOS			.65 mm	S-PBGA-B196
MCIMX281AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100	1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B289	3	Not Qualified	e1
MCIMX6Y1DVK05AA	NXP Semiconductors	SoC	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX251AJM4AR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.