LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
66AK2G12ABYA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm			30	260	21 mm	CMOS	1 V			.8 mm		S-PBGA-B625	3			e1
66AK2G12ABYA60E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm			30	260	21 mm	CMOS	.9 V			.8 mm		S-PBGA-B625	3			e1
SCANSTA101SM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.5 mm		7 mm			20	235	7 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	3	Not Qualified		e0
TMS320DM369ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32	30	260	13 mm	CMOS		Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
DM355SZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335ZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	100 Cel	-40 Cel		BOTTOM	1.3 mm		13 mm					13 mm	CMOS	1.3 V			.65 mm		S-PBGA-B337		Not Qualified
TMS320DM6446BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm		48	30	260	16 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMS320DM355DZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32	30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6446BZWT8	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm		48	30	260	16 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMS320DM6443ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		30	260	16 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified
TMS320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48	30	260	16 mm	CMOS	1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
OMAP3515DCUS72	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA423,24X24,25	1.71 V	90 Cel	0 Cel		BOTTOM	1.4 mm		16 mm			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1.8 V	Graphics Processors		.65 mm		S-PBGA-B423		Not Qualified
OMAPL132BZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V			TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.2 V TYP		30	260	16 mm	CMOS	1 V	Other Microprocessor ICs		.8 mm		S-PBGA-B361	3	Not Qualified		e1
DM355SZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM357ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	4096	16 mm	ALSO REQUIRES 3.3 V I/O SUPPLY		30	260	16 mm	CMOS	1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMS320DM335DZCEA13	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DM355SZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		30	260	16 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified
AM4379BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm	CMOS	1.26 V			.65 mm		S-PBGA-B491	3			e1
OMAP3503DCUS	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm			30	260	16 mm	CMOS	1.8 V	Graphics Processors		.8 mm		S-PBGA-B423	4	Not Qualified		e1
TMS320DM6441ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1.05 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
DM355SZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335DZCEA21	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335ZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	100 Cel	-40 Cel		BOTTOM	1.3 mm		13 mm					13 mm	CMOS	1.3 V			.65 mm		S-PBGA-B337		Not Qualified
OMAPL132BZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V			TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP		30	260	16 mm	CMOS	1 V	Other Microprocessor ICs		.8 mm		S-PBGA-B361	3	Not Qualified		e1
TMS320VER6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		30	260	16 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified
TMS320DM355ZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
SCANSTA111SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.5 mm		7 mm			20	235	7 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	3	Not Qualified		e0
TMS320DM369ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32	30	260	13 mm	CMOS		Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM355CZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32	30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM365ZCE27	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32	30	260	13 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
DM355SDZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
OMAPL132ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel		BOTTOM	1.4 mm		16 mm					16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361
DM355SZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
AM4372BZDN60	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.144 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm	CMOS	1.1 V			.65 mm		S-PBGA-B491	3			e1
OMAPL132EZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
TMS320DM365SVZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V				BOTTOM	1.3 mm	8192	13 mm					13 mm	CMOS	1.35 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
OMAPL138ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V				BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				16 mm	CMOS	1.3 V			.8 mm		S-PBGA-B361
AM4372BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm	CMOS	1.26 V			.65 mm		S-PBGA-B491	3			e1
TMS320DM365VZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V				BOTTOM	1.3 mm	8192	13 mm					13 mm	CMOS	1.35 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TMS320DM335DZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355ZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355DZCEA21	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32	30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
SCANSTA111SM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.5 mm		7 mm			20	235	7 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	3	Not Qualified		e0
TMS320DM365SVZCE27	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V				BOTTOM	1.3 mm	8192	13 mm					13 mm	CMOS	1.2 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
OMAP3515DCUS	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA423,24X24,25	1.71 V	90 Cel	0 Cel		BOTTOM	1.4 mm		16 mm			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1.8 V	Graphics Processors		.65 mm		S-PBGA-B423		Not Qualified
OMAPL132EZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.