LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
XQ7Z020-1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel		-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm		19 mm				30	225	19 mm		CMOS			Other uPs/uCs/Peripheral ICs		.8 mm		S-PBGA-B484	3	Not Qualified		e0
XQ7Z020-1CL484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel		-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm		19 mm				30	225	19 mm		CMOS			Other uPs/uCs/Peripheral ICs		.8 mm		S-PBGA-B484	3	Not Qualified		e0
MTFC64GJVDN-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		14 mm	IT ALSO OPERATES AT 3.3 VOLTS					18 mm		CMOS		1.8 V			.5 mm		R-PBGA-B169				e1
XC7Z010-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		0 Cel			BOTTOM	1.5 mm		13 mm						13 mm		CMOS		1 V			.8 mm		S-PBGA-B225
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel		-40 Cel			BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm		CMOS		1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm		CMOS		1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel			BOTTOM	1.5 mm		19 mm			500 MHz		260	19 mm		CMOS		1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
MCIMX257DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm		CMOS		1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX258CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm		CMOS		1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX283CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V			.8 mm		S-PBGA-B289	3
MCIMX285AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100		1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V	Microprocessors		.8 mm		S-PBGA-B289	3	Not Qualified		e1
MCIMX503CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ			40	260	17 mm		CMOS		1.225 V			.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX508CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm		13 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ			40	260	13 mm		CMOS		1.225 V			.5 mm		S-PBGA-B416	3	Not Qualified		e1
MCIMX512CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm				40	260	19 mm		CMOS		1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX512DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm				40	260	19 mm		CMOS		1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX6D5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE			40	260	21 mm		CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6D7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.25 mm		12 mm				40	260	12 mm		CMOS		1.4 V			.4 mm		S-PBGA-B569	3			e1
MCIMX6Q7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.25 mm		12 mm				40	260	12 mm		CMOS		1.4 V			.4 mm		S-PBGA-B569	3			e1
MCIMX6S5EVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm				40	260	21 mm		CMOS					.8 mm		S-PBGA-B624	3			e1
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel		-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.5 mm		13 mm						13 mm		CMOS			Other uPs/uCs/Peripheral ICs		.8 mm		S-PBGA-B225	3	Not Qualified		e1
SM32DM355GCEM216EP	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	125 Cel		-55 Cel	TIN LEAD		BOTTOM	1.3 mm	8192	13 mm		32			260	13 mm		CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3			e0
PAM1806BZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
XAM1806BZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
SN74LVT8986ZGV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	2.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		8 mm		0		30	260	8 mm		BICMOS		3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	3	Not Qualified		e1
V62/09643-01XE	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	125 Cel		-55 Cel	TIN LEAD		BOTTOM	1.3 mm	8192	13 mm		32			260	13 mm		CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3			e0
VVLOG365ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.28 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm				30	260	13 mm		CMOS		1.2 V			.65 mm		S-PBGA-B338	3			e1
CP3SP33SMRX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		10 mm				30	260	10 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers		.8 mm		S-PBGA-B144	3	Not Qualified	96 rpm	e1
PAM1806BZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TMX320DM6443BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel			BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
POMAPL132BZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
TMX320DM365AZCE300	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel			BOTTOM	1.3 mm		13 mm						13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338		Not Qualified
TMX320DM6446DZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel			BOTTOM	1.4 mm		16 mm						16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B316
SN3490586	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
XOMAPL132BZWT2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
CP3SP33SMR/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		10 mm				30	260	10 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers		.8 mm		S-PBGA-B144	3	Not Qualified	96 rpm	e1
AM1806BZWTD3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
POMAPL132BZWT2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
TNETV1647GSTZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
PAM1806BZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
TMX320DM365BZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel		0 Cel			BOTTOM	1.3 mm	8192	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS		1.2 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TMX320DM355ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel			BOTTOM	1.3 mm	32768	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
PAM1806BZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
AM1806BZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
XOMAPL132BZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V						BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZCED3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
XAM1806BZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.