LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
TMX320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm						16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B316
TMX320DM6443ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY					16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
PAM1806BZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TNETV6446AINZWT8	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
XAM1806BZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
PAM1806BZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
XAM1806BZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TMX320DM365AZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.3 mm		13 mm						13 mm		CMOS		1.2 V			.65 mm		S-PBGA-B338		Not Qualified
AM1806BZCEA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
XAM1806BZWTD3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZCEA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
XAM1806BZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
PAM1806BZCEA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
CP3SP33SMS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	224	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA224,15X15,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN LEAD	BOTTOM	1.4 mm		13 mm		32		30	260	13 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers	I2C; I2S; SPI; UART; USB	.8 mm		S-PBGA-B224	3	Not Qualified	96 rpm	e0
PAM1806BZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
AM1806BZCED3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
PAM1806BZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
TMX320DM6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY					16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMX320DM6441DZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP					16 mm		CMOS		1.05 V			.8 mm		S-PBGA-B316
CP3SP33SMSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	224	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA224,15X15,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN LEAD	BOTTOM	1.4 mm		13 mm		32		30	260	13 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers	I2C; I2S; SPI; UART; USB	.8 mm		S-PBGA-B224	3	Not Qualified	96 rpm	e0
SM320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	20480	16 mm	ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY	48	27 MHz	30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMX320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY					16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMX320DM6443CZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm						16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B316
XAM1806BZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
SN74LVT8986GGV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	2.7 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm		8 mm				20	220	8 mm		BICMOS		3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	3	Not Qualified		e0
PAM1806BZCED3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
PAM1806BZWTD3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
TMX320DM355ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel		BOTTOM	1.3 mm	32768	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
PAM1806BZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TMS320DM355DZCEA13	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V				TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355CZCEA21	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm		CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
OMAP3515DCUSA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA423,24X24,25	1.71 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.8 V	Graphics Processors		.65 mm		S-PBGA-B423	4	Not Qualified		e1
SCANSTA101SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.5 mm		7 mm				20	235	7 mm		CMOS		3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	3	Not Qualified		e0
DM355SDZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm		CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
TMS320DM6443BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	20480	16 mm		48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified		e1
TMS320DM365SZCE27	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V					BOTTOM	1.3 mm	8192	13 mm						13 mm		CMOS		1.2 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
DM355SDZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
OMAPL132BZWT2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
TMS320DM6446BZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm		48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
SCANSTA111SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		7 mm				30	260	7 mm		CMOS		3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	4	Not Qualified		e1
TMS320DM335CZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
AM4377BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm		CMOS		1.26 V			.65 mm		S-PBGA-B491	3			e1
TMS320DM6441BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	32	1.05/1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	20480	16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP	48		30	260	16 mm		CMOS		1.05 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified		e1
TMS320DM357AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm	ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
TMS320DM365VZCE27	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V					BOTTOM	1.3 mm	8192	13 mm						13 mm		CMOS		1.2 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TMS320DM335ZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.