LFBGA Other Function uPs,uCs & Peripheral ICs 680

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX355AVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX353CJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MIMX8MN3DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER		BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3		e2
MCIMX6S5EVM10ABR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	21 mm		40	260	21 mm	CMOS		Graphics Processors	.8 mm	S-PBGA-B624	3	Not Qualified	e1
MCIMX508CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6G3CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel			BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX507CVK8BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	.95 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.05 V		.5 mm	S-PBGA-B416	3	Not Qualified	e1
MCIMX31DVMN5D	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	1.52 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.54 mm	19 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	19 mm	CMOS		Microprocessors	.8 mm	S-PBGA-B473	3	Not Qualified	e1
MCIMX27MOP4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.54 mm	19 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	19 mm	CMOS	1.45 V		.8 mm	S-PBGA-B473	3	Not Qualified	e1
MCIMX6X3EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X1EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X1EVK10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS			.65 mm	S-PBGA-B400	3		e1
MCIMX255AJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX508CVM1B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400		Not Qualified
MCIMX357DJQ5C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX502CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6G2AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel			BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6D5EYM12AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6G2AVM07AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	125 Cel	-40 Cel			BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX280DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX31LCVKN5D	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	457	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA457,26X26,20	1.52 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	14 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	14 mm	CMOS		Microprocessors	.5 mm	S-PBGA-B457	3	Not Qualified	e1
MCIMX31CVKN5D	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	457	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA457,26X26,20	1.52 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	14 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	14 mm	CMOS		Microprocessors	.5 mm	S-PBGA-B457	3	Not Qualified	e1
MCIMX6U8DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6S8DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6S1AVM08ABR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	21 mm		40	260	21 mm	CMOS		Graphics Processors	.8 mm	S-PBGA-B624	3	Not Qualified	e1
MCIMX6G2AVM05AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel	TIN SILVER		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e2
MCIMX280DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX508CVM8BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.05 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MIMX8MN2DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER		BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3		e2
MCIMX6DP5EYM1AB	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX251AJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX355AJQ4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400		Not Qualified
MCIMX6QP5EYM1AB	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX511AJM6C	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	125 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529		Not Qualified
MCIMX353DJQ5C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX502CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	.95 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.05 V		.5 mm	S-PBGA-B416	3	Not Qualified	e1
MCIMX351AVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400
MCIMX6Y1CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e1
MCIMX27VJP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	17 mm	CMOS	1.45 V		.65 mm	S-PBGA-B404	3	Not Qualified	e1
MCIMX283DVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX6S8DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6Y1DVK05AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel			BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6X2EVN10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6S5EVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
XQ7Z020-2CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQ7Z020-L1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, LOW PROFILE, FINE PITCH			100 Cel	-40 Cel	TIN LEAD		BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS			.8 mm	S-PBGA-B484	3		e0
XQ7Z020-L1CL400I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, LOW PROFILE, FINE PITCH			100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	1.6 mm	17 mm		NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS			.8 mm	S-PBGA-B400			e0
XQ7Z020-1CL400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Lead (Sn/Pb)	N	BOTTOM	1.6 mm	17 mm		NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400		Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.