AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 253

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX6Q4AVT08AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT08AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6D4AVT10ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6G1AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX6D6AVT10ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6D4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3
MIMX8DX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS		1.1 V		.8 mm	S-PBGA-B609	3		e2
MCIMX6DP6AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6D4AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMX8DX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm		40	260	17 mm	CMOS		1.1 V		.8 mm	S-PBGA-B417	3
MCIMX6Q6AVT08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6Q4AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX514AJM6CR2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS		1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX516AJM6CR2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS		1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MIMX8DX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS		1.1 V		.8 mm	S-PBGA-B609	3
MCIMX6DP4AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3
MCIMX514AJM6C	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS		1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MIMX8QX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm		40	260	17 mm	CMOS		1.1 V		.8 mm	S-PBGA-B417	3
MCIMX6DP6AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3
MIMX8QX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm		40	260	17 mm	CMOS		1.1 V		.8 mm	S-PBGA-B417	3
MCIMX6G2AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX6G2AVM07AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	125 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX6G2AVM05AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3		e2
MCIMX6Q4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6Q4AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
CY8C21534-12PVXET	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100	5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm		20	260	10.2 mm	CMOS		5 V	Microcontrollers	.65 mm	R-PDSO-G28	3	Not Qualified	e4
CY8C21512-12PVXET	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm					10.2 mm	CMOS		5 V		.65 mm	R-PDSO-G28	3		e4
CY8C3846PVE-174	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	125 Cel	-40 Cel	MATTE TIN	DUAL	2.794 mm	7.5057 mm				15.875 mm	CMOS		3.3 V		.635 mm	R-PDSO-G48	3		e3
CY8C21312-12PVXET	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				7.2 mm	CMOS		5 V		.65 mm	R-PDSO-G20	3		e4
CY8C21345-12PVXET	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100	5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm	IT ALSO OPERATES AT 3V AT 93KHZ	20	260	10.2 mm	CMOS		5 V	Microcontrollers	.65 mm	R-PDSO-G28	3	Not Qualified	e4
CY8C21512-12PVXE	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm					10.2 mm	CMOS		5 V		.65 mm	R-PDSO-G28	3		e4
CY8C21534-12PVXE	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm		20	260	10.2 mm	CMOS		5 V	Microcontrollers	.65 mm	R-PDSO-G28	3	Not Qualified	e4
CY8C21334-12PVXE	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	125 Cel	-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm		20	260	7.2 mm	CMOS		5 V	Microcontrollers	.65 mm	R-PDSO-G20	3	Not Qualified	e3
CY8C21312-12PVXE	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				7.2 mm	CMOS		5 V		.65 mm	R-PDSO-G20	3		e4
CY8C3845PVE-173	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	125 Cel	-40 Cel	MATTE TIN	DUAL	2.794 mm	7.5057 mm				15.875 mm	CMOS		3.3 V		.635 mm	R-PDSO-G48	3		e3
CY8C21334-12PVXET	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	125 Cel	-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm		20	260	7.2 mm	CMOS		5 V	Microcontrollers	.65 mm	R-PDSO-G20	3	Not Qualified	e3
CY8C21345-12PVXE	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100	5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm	IT ALSO OPERATES AT 3V AT 93KHZ	20	260	10.2 mm	CMOS		5 V	Microcontrollers	.65 mm	R-PDSO-G28	3	Not Qualified	e4
SAK-TC277T-64F200S	Infineon Technologies	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	292	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS		3.3 V			S-PBGA-B292			e1
SAK-TC275T-64F200W	Infineon Technologies	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK			125 Cel	-40 Cel	MATTE TIN	QUAD							CMOS		3.3 V			S-PQFP-G176			e3
MAX7349AEG	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	2.4 V	125 Cel	-40 Cel	TIN LEAD	DUAL	1.73 mm	3.9 mm				8.65 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G24	1	Not Qualified	e0
MAX7347ATE+	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	2.4 V	125 Cel	-40 Cel	MATTE TIN	QUAD	.8 mm	4 mm	MONITORS UP TO 24 KEYS	30	260	4 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.65 mm	S-XQCC-N16	1	Not Qualified	e3
MAX7347AEE-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	2.4 V	125 Cel	-40 Cel	TIN LEAD	DUAL	1.73 mm	3.9 mm				4.89 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G16	1	Not Qualified	e0
MAX7348AEP-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	2.4 V	125 Cel	-40 Cel	TIN LEAD	DUAL	1.73 mm	3.9 mm				8.65 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G20		Not Qualified	e0
MAX7347ATE+T	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	2.4 V	125 Cel	-40 Cel	MATTE TIN	QUAD	.8 mm	4 mm	MONITORS UP TO 24 KEYS	30	260	4 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.65 mm	S-XQCC-N16	1	Not Qualified	e3
MAX7349AEG-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	2.4 V	125 Cel	-40 Cel	TIN LEAD	DUAL	1.73 mm	3.9 mm				8.65 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G24		Not Qualified	e0
MAX7348AEP	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	2.4 V	125 Cel	-40 Cel	TIN LEAD	DUAL	1.73 mm	3.9 mm				8.65 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G20	1	Not Qualified	e0
MAX7347AEE	Maxim Integrated	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	2.4 V	125 Cel	-40 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm				4.9 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G16	1	Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.