AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 253

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XQ7Z045-1RF676Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA676,26X26,40

125 Cel

-40 Cel

TIN LEAD

N

BOTTOM

3.37 mm

27 mm

30

225

27 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B676

4

Not Qualified

e0

XQ7Z020-1CL400Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

125 Cel

-40 Cel

Tin/Lead (Sn/Pb)

N

BOTTOM

1.6 mm

17 mm

NOT SPECIFIED

NOT SPECIFIED

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

Not Qualified

e0

XQ7Z030-1RB484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA484,22X22,40

125 Cel

-40 Cel

TIN LEAD

N

BOTTOM

3.35 mm

23 mm

30

225

23 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B484

4

Not Qualified

e0

XQ7Z030-1RF900Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA900,30X30,40

125 Cel

-40 Cel

TIN LEAD

N

BOTTOM

3.44 mm

31 mm

31 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B900

Not Qualified

e0

XQ7Z045-1RF900Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA900,30X30,40

125 Cel

-40 Cel

TIN LEAD

N

BOTTOM

3.44 mm

31 mm

31 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B900

Not Qualified

e0

XAZU2EG-1SBVA484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.61 mm

19 mm

30

250

19 mm

CMOS

.85 V

.8 mm

S-PBGA-B484

3

e1

XAZU3EG-1SBVA484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.61 mm

19 mm

30

250

19 mm

CMOS

.85 V

.8 mm

S-PBGA-B484

3

e1

XAZU2EG-1SFVA625Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

625

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.43 mm

21 mm

30

250

21 mm

CMOS

.85 V

.8 mm

S-PBGA-B625

3

e1

XAZU2EG-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XA7Z030-1FBG484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY

BGA484,22X22,40

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

N

BOTTOM

2.54 mm

23 mm

30

250

23 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B484

4

Not Qualified

e1

XAZU3EG-1SFVA625Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

625

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.43 mm

21 mm

30

250

21 mm

CMOS

.85 V

.8 mm

S-PBGA-B625

3

e1

ZAMC4100GA2V

Renesas Electronics

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

18 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

6 V

125 Cel

-40 Cel

TIN

QUAD

.9 mm

9 mm

260

9 mm

CMOS

13 V

.5 mm

S-PQCC-N64

1

e3

ZAMC4100GA2R

Renesas Electronics

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

18 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

6 V

125 Cel

-40 Cel

TIN

QUAD

.9 mm

9 mm

260

9 mm

CMOS

13 V

.5 mm

S-PQCC-N64

1

e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.