AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 253

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	DAC Channels	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
PGA460TPWQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm		4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm	CMOS	12 V			SPI; UART; USART	.65 mm	R-PDSO-G16	2			e4
MCIMX6Q6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm		21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm	S-PBGA-B624	3			e1
MCIMX6Q6AVT10ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel				BOTTOM		2.16 mm		21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm	S-PBGA-B624	3
MIMX8QX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER			BOTTOM		2.52 mm		21 mm						40	260	21 mm	CMOS	1.1 V				.8 mm	S-PBGA-B609	3			e2
PGA460TPWRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm		4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm	CMOS	12 V			SPI; UART; USART	.65 mm	R-PDSO-G16	2			e4
STSPIN32F0A	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V					CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel	-40 Cel				QUAD				7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS	8 V				.5 mm	S-XQCC-N48
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN SILVER COPPER		N	BOTTOM		1.6 mm		19 mm						30	260	19 mm	CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B484	3	Not Qualified		e1
PGA460TPWR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm		4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm	CMOS	12 V			SPI; UART; USART	.65 mm	R-PDSO-G16	2			e4
MCP25050-E/P	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8		5	IN-LINE	DIP14,.3	4.5 V	125 Cel	-40 Cel	MATTE TIN			DUAL		4.318 mm		7.62 mm								19.05 mm	CMOS	5 V		Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified		e3
MCIMX6Q6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm		21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm	S-PBGA-B624	3			e1
STSPIN32F0ATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V					CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel	-40 Cel				QUAD				7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS	8 V				.5 mm	S-XQCC-N48
PGA460TPW	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm		4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm	CMOS	12 V			SPI; UART; USART	.65 mm	R-PDSO-G16	2			e4
STSPIN32F0	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel	-40 Cel				QUAD		1 mm		7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS					.5 mm	S-XQCC-N48
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100				GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER			BOTTOM		1.85 mm		19 mm						40	260	19 mm	CMOS	1.1 V				.8 mm	S-PBGA-B529	3			e2
STSPIN32F0TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel	-40 Cel				QUAD		1 mm		7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS					.5 mm	S-XQCC-N48
UCD3138128PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.2 mm		12 mm						30	260	12 mm	CMOS	3.3 V				.5 mm	S-PQFP-G80	3			e4
EFR32MG21A020F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN			QUAD		.9 mm		4 mm						40	260	4 mm	CMOS	3 V				.4 mm	S-XQCC-N32	2			e3
EFR32MG21A020F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN			QUAD		.9 mm		4 mm						40	260	4 mm	CMOS	3 V				.4 mm	S-XQCC-N32	2			e3
MCIMX6Q6AVT10ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm		21 mm						40	260	21 mm	CMOS					.8 mm	S-PBGA-B624	3			e1
MCIMX6Q6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel				BOTTOM		2.16 mm		21 mm						40	260	21 mm	CMOS	1.4 V				.8 mm	S-PBGA-B624	3
EFR32MG21A020F768IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN			QUAD		.9 mm		4 mm						40	260	4 mm	CMOS	3 V				.4 mm	S-XQCC-N32	2			e3
EFR32MG21A010F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN			QUAD		.9 mm		4 mm						40	260	4 mm	CMOS	3 V				.4 mm	S-XQCC-N32	2			e3
EFR32MG21A010F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN			QUAD		.9 mm		4 mm						40	260	4 mm	CMOS	3 V				.4 mm	S-XQCC-N32	2			e3
EFR32MG21A010F768IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN			QUAD		.9 mm		4 mm						40	260	4 mm	CMOS	3 V				.4 mm	S-XQCC-N32	2			e3
MCIMX6X1AVK08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		14 mm						40	260	14 mm	CMOS	1.8 V				.65 mm	S-PBGA-B400	3			e1
UCD3138ARJAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES		QUAD		1 mm		6 mm						30	260	6 mm	CMOS	3.3 V				.5 mm	S-PQCC-N40	2			e4
MCIMX536AVV8C	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER			BOTTOM		1.85 mm		19 mm						40	260	19 mm	CMOS	1.1 V		Graphics Processors		.8 mm	S-PBGA-B529	3	Not Qualified		e2
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm		3.9 mm								8.65 mm	CMOS	5 V		Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MCIMX6X2AVN08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.53 mm		17 mm						40	260	17 mm	CMOS	1.8 V				.8 mm	S-PBGA-B400	3			e1
MCIMX6X1AVO08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.53 mm		17 mm						40	260	17 mm	CMOS	1.8 V				.8 mm	S-PBGA-B400	3			e1
MCIMX6S6AVM08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm		21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm	CMOS					.8 mm	S-PBGA-B624	3			e1
UCD3138A64PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			NO		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	NO	1.2 mm	65536	12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm	CMOS	3.3 V	NO		I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4	8	43
AM5716AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm		23 mm						30	250	23 mm	CMOS	1.15 V				.8 mm	S-PBGA-B760	3			e1
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm		3.9 mm								8.65 mm	CMOS	5 V		Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified		e3
UCD3138128APFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.2 mm		12 mm				0	2 MHz	30	260	12 mm	CMOS	3.3 V			I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4
XA7Z020-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		N	BOTTOM		1.6 mm		17 mm						30	260	17 mm	CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B400	3	Not Qualified		e1
MPXY8500DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel				QUAD		2.3 mm		9 mm						NOT SPECIFIED	NOT SPECIFIED	9 mm	CMOS	3 V				.65 mm	S-XQCC-N32
MCIMX6D6AVT08AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm		21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS	1.4 V				.8 mm	S-PBGA-B624	3			e1
AM5716AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm		23 mm						30	250	23 mm	CMOS	1.15 V				.8 mm	S-PBGA-B760	3			e1
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		3.32 mm		23 mm						30	250	23 mm	CMOS	.85 V				.8 mm	S-PBGA-B784	4			e1
MCIMX534AVV8C	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER			BOTTOM		1.85 mm		19 mm						40	260	19 mm	CMOS	1.1 V		Graphics Processors		.8 mm	S-PBGA-B529	3	Not Qualified		e2
MCIMX6X4AVM08AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.52 mm		19 mm						40	260	19 mm	CMOS					.8 mm	S-PBGA-B529	3			e1
XAZU7EV-1FBVB900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.97 mm		31 mm				0		30	245	31 mm	CMOS	.85 V			CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4			e1
UCD3138ARGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES		QUAD		1 mm		9 mm				0	2 MHz	30	260	9 mm	CMOS	3.3 V			I2C; UART	.5 mm	S-PQCC-N64	2			e4
AM5718AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm		23 mm						30	250	23 mm	CMOS	1.15 V				.8 mm	S-PBGA-B760	3		1500 rpm	e1
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100				GRID ARRAY			125 Cel	-40 Cel				BOTTOM													CMOS						S-PBGA-B484
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		3.32 mm		23 mm						30	250	23 mm	CMOS	.85 V				.8 mm	S-PBGA-B784	4			e1
AM5718AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm		23 mm						30	250	23 mm	CMOS	1.15 V				.8 mm	S-PBGA-B760	3		1500 rpm	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.