AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 253

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MCIMX6D6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER			BOTTOM		1.85 mm			19 mm						40	260	19 mm		CMOS		1.1 V				.8 mm	S-PBGA-B529	3			e2
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel				BOTTOM		2.16 mm			21 mm						40	260	21 mm		CMOS		1.4 V				.8 mm	S-PBGA-B624	3
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.17 mm			10.4 mm						30	260	10.4 mm	1572864	CMOS		1.2 V				.65 mm	S-PBGA-B161	3			e1
EFR32MG21B020F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel				QUAD		.9 mm			4 mm								4 mm		CMOS		3 V				.4 mm	S-XQCC-N32
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel				BOTTOM		2.52 mm			21 mm						40	260	21 mm		CMOS		1.1 V				.8 mm	S-PBGA-B609	3
UCD3138A64PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		NO		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	NO	1.2 mm	65536		12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS		3.3 V	NO		I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4	8	43
CC2540TF256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm		8	6 mm						30	260	6 mm	8192	CMOS		3 V			SPI; USART; USB	.5 mm	S-PQCC-N40	3			e4		21
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel				BOTTOM		1.85 mm			19 mm								19 mm		CMOS		1.1 V				.8 mm	S-PBGA-B529
EFR32MG21B020F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel				QUAD		.9 mm			4 mm								4 mm		CMOS		3 V				.4 mm	S-XQCC-N32
XQ7Z030-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel	-40 Cel	TIN LEAD		N	BOTTOM		3.37 mm			27 mm						30	225	27 mm		CMOS				Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified		e0
AS82527F8	Intel		AUTOMOTIVE	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES				5	FLATPACK	QFP44,.5SQ,32		125 Cel	-40 Cel				QUAD															CMOS	50 mA	5 V		Other uPs/uCs/Peripheral ICs		.8 mm	S-PQFP-G44		Not Qualified
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		N	BOTTOM		1.6 mm			17 mm						30	260	17 mm		CMOS				Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B400	3	Not Qualified		e1
XQ7Z020-1CL484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN LEAD		N	BOTTOM		1.6 mm			19 mm						30	225	19 mm		CMOS				Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B484	3	Not Qualified		e0
EFR32MG21B010F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel				QUAD		.9 mm			4 mm								4 mm		CMOS		3 V				.4 mm	S-XQCC-N32
SI8250-IQ	Silicon Labs	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	2.75 V				FLATPACK, LOW PROFILE		2.25 V	125 Cel	-40 Cel				QUAD		1.6 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS		2.5 V				.8 mm	S-PQFP-G32		Not Qualified
SI8251-IQ	Silicon Labs	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	2.75 V				FLATPACK, LOW PROFILE		2.25 V	125 Cel	-40 Cel				QUAD		1.6 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS		2.5 V				.8 mm	S-PQFP-G32		Not Qualified
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS		.85 V				.8 mm	S-PBGA-B784	4			e1
XQ7Z045-1RFG676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			125 Cel	-40 Cel				BOTTOM		3.37 mm			27 mm						NOT SPECIFIED	NOT SPECIFIED	27 mm		CMOS						1 mm	S-PBGA-B676
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				32	32 MHz	30	250	15 mm		CMOS		1.06 V			I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
MCIMX6D6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm						40	260	21 mm		CMOS		1.4 V				.8 mm	S-PBGA-B624	3			e1
SFR4310E1MAE40	NXP Semiconductors		AUTOMOTIVE	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES				2.5,3.3	FLATPACK	QFP64,.47SQ,20		125 Cel	-40 Cel	TIN			QUAD											40	260			CMOS				Other uPs/uCs/Peripheral ICs		.5 mm	S-PQFP-G64	3	Not Qualified		e3
UCD3138ARJAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES		QUAD		1 mm			6 mm						30	260	6 mm		CMOS		3.3 V				.5 mm	S-PQCC-N40	2			e4
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel	-40 Cel	TIN SILVER COPPER		N	BOTTOM		1.5 mm			13 mm								13 mm		CMOS				Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B225	3	Not Qualified		e1
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm				64	32 MHz	30	250	23 mm		CMOS		1.15 V			CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1500 rpm	e1
DRA782BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DM505LRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				32	32 MHz	30	250	15 mm		CMOS		1.06 V			I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA785BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				32	32 MHz	30	250	15 mm		CMOS		1.06 V			I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3			e1
X1642BIGABL	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel				BOTTOM		1.17 mm			10.4 mm								10.4 mm		CMOS		1.2 V				.65 mm	S-PBGA-B161
DRA752BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS		1.15 V				.8 mm	S-PBGA-B760	3			e1
DRA787BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA750BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm				48	32 MHz	30	250	23 mm		CMOS		1.15 V			CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1000 rpm	e1
DM505MRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				32	32 MHz	30	250	15 mm		CMOS		1.06 V			I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA786BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA751BLGABCQ	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel				BOTTOM		2.96 mm			23 mm								23 mm		CMOS		1.15 V				.8 mm	S-PBGA-B760
DRA786BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA783BRJABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				32	32 MHz			15 mm		CMOS		1.06 V			CAN(2), I2C(2), SPI(4), QSPI, UART(3)	.65 mm	S-PBGA-B367				e1
DRA745BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm				64	32 MHz	30	250	23 mm		CMOS		1.15 V			CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1176 rpm	e1
DRA746BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm				64	32 MHz	30	250	23 mm		CMOS		1.15 V			CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1500 rpm	e1
DRA782BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
AWR1642ABISABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		1.17 mm			10.4 mm						NOT SPECIFIED	260	10.4 mm	1572864	CMOS		1.2 V				.65 mm	S-PBGA-B161	3			e1
AWR1642ABISABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.17 mm			10.4 mm						30	260	10.4 mm	1572864	CMOS		1.2 V				.65 mm	S-PBGA-B161	3			e1
DRA780BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA755BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel				BOTTOM		2.96 mm			23 mm								23 mm		CMOS		1.15 V				.8 mm	S-PBGA-B760
TSS400AFN-S1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V				CHIP CARRIER		2.6 V	125 Cel	-40 Cel				QUAD		4.57 mm			16.5862 mm						NOT SPECIFIED	NOT SPECIFIED	16.5862 mm		CMOS		3 V				1.27 mm	S-PQCC-J44		Not Qualified
DRA783BRJABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				32	32 MHz			15 mm		CMOS		1.06 V			CAN(2), I2C(2), SPI(4), QSPI, UART(3)	.65 mm	S-PBGA-B367				e1
DRA787BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.