AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 253

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
XDM505XXBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY		1.11 V	125 Cel	-40 Cel			BOTTOM											CMOS		1.15 V				S-PBGA-B367
DRA788BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3			e1
DRA755BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel			BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm	S-PBGA-B760
DRA745BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1176 rpm	e1
AWR1443FQIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm		10.4 mm				30	260	10.4 mm	589824	CMOS		1.2 V			.65 mm	S-PBGA-B161	3			e1
DRA750BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel			BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm	S-PBGA-B760
DRA744BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1000 rpm	e1
DRA754BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel			BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm	S-PBGA-B760
DRA744BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1000 rpm	e1
DRA781BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA788BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3			e1
UCD3138ARMHT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	.8 mm		6 mm		0	2 MHz	30	260	6 mm		CMOS		3.3 V		I2C; UART	.5 mm	S-PQCC-N40	2			e4
CC2540TF256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8	6 mm				30	260	6 mm	8192	CMOS		3 V		SPI; USART; USB	.5 mm	S-PQCC-N40	3			e4	21
UCD3138128APFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm		12 mm		0	2 MHz	30	260	12 mm		CMOS		3.3 V		I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4
DRA784BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3			e1
DRA754BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel			BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm	S-PBGA-B760
XDRA821UXXGALM	Texas Instruments	SoC	AUTOMOTIVE	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel			BOTTOM	2.57 mm		17.2 mm						17.2 mm		CMOS		.8 V			.8 mm	S-PBGA-B433			2000 rpm
DRA784BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3			e1
UCD3138ARMHR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	.8 mm		6 mm		0	2 MHz	30	260	6 mm		CMOS		3.3 V		I2C; UART	.5 mm	S-PQCC-N40	2			e4
DRA780BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA752BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		23 mm				30	250	23 mm		CMOS		1.15 V			.8 mm	S-PBGA-B760	3			e1
DRA746APGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY					TIN SILVER COPPER		BOTTOM							30	250			CMOS						X-PBGA-B760	3		1500 rpm	e1
DRA746BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1500 rpm	e1
DRA751BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel			BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm	S-PBGA-B760
AWR1443FQIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.17 mm		10.4 mm				30	260	10.4 mm	589824	CMOS		1.2 V			.65 mm	S-PBGA-B161	3			e1
AWR1642ABIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.17 mm		10.4 mm				30	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm	S-PBGA-B161	3			e1
DM505LRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA785BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3			e1
UCD3138128PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm		12 mm				30	260	12 mm		CMOS		3.3 V			.5 mm	S-PQFP-G80	3			e4
UCD3138ARGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	1 mm		9 mm		0	2 MHz	30	260	9 mm		CMOS		3.3 V		I2C; UART	.5 mm	S-PQCC-N64	2			e4
X1443BIGABL	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel			BOTTOM	1.17 mm		10.4 mm						10.4 mm		CMOS		1.2 V			.65 mm	S-PBGA-B161
DRA781BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
DRA783BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100		GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
66AK2G12ABYT100	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.56 mm		21 mm				30	260	21 mm		CMOS		1 V			.8 mm	S-PBGA-B625	3			e1
MAX7347AEE+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	2.4 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.73 mm		3.9 mm	MONITORS UP TO 24 KEYS			30	260	4.89 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.635 mm	R-PDSO-G16	1	Not Qualified		e3
MAX7348AEP+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	2.4 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.73 mm		3.9 mm				30	260	8.65 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.635 mm	R-PDSO-G20	1	Not Qualified		e3
MAX7349AWG	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE	SOP24,.4	2.4 V	125 Cel	-40 Cel	TIN LEAD		DUAL	2.65 mm		7.5 mm						15.4 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		1.27 mm	R-PDSO-G24	1	Not Qualified		e0
MAX7347AEE+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	2.4 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.75 mm		3.9 mm				30	260	4.9 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.635 mm	R-PDSO-G16	1	Not Qualified		e3
MAX7348AEP+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	2.4 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.73 mm		3.9 mm	MONITORS UP TO 40 KEYS			30	260	8.65 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.635 mm	R-PDSO-G20	1	Not Qualified		e3
MAX7349ATG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.4 V	125 Cel	-40 Cel	MATTE TIN		QUAD	.8 mm		4 mm	MONITORS UP TO 64 KEYS			30	260	4 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.5 mm	S-XQCC-N24	1	Not Qualified		e3
MAX7349AEG+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	2.4 V	125 Cel	-40 Cel	MATTE TIN		DUAL	1.73 mm		3.9 mm	MONITORS UP TO 64 KEYS			30	260	8.65 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.635 mm	R-PDSO-G24	1	Not Qualified		e3
MAX7349ATG+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.4 V	125 Cel	-40 Cel	MATTE TIN		QUAD	.8 mm		4 mm	MONITORS UP TO 64 KEYS			30	260	4 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.5 mm	S-XQCC-N24	1	Not Qualified		e3
MAX7349AEG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	2.4 V	125 Cel	-40 Cel	MATTE TIN		DUAL	1.73 mm		3.9 mm				30	260	8.65 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port		.635 mm	R-PDSO-G24	1	Not Qualified		e3
DS8007A-EAG+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V		3.3	FLATPACK, LOW PROFILE	QFP48,.35SQ,20	2.7 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		QUAD	1.6 mm		7 mm	AVAILABLE IN 0.5 PITCH ALSO			30	260	7 mm		CMOS	325 mA	3.3 V	Other Microprocessor ICs		.8 mm	S-PQFP-G48	1	Not Qualified		e3
DS8007A-EAG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V			FLATPACK, LOW PROFILE		2.7 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		QUAD	1.6 mm		7 mm	AVAILABLE IN 0.5 PITCH ALSO			30	260	7 mm		CMOS		3.3 V			.8 mm	S-PQFP-G48	1			e3
L99MM70XP	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	18 V			SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		6 V	125 Cel	-40 Cel	Tin (Sn)		DUAL	2.45 mm		7.5 mm				30	260	10.3 mm		CMOS		13.5 V			.5 mm	R-PDSO-G36	3			e3
L99MM70XPTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	18 V			SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		6 V	125 Cel	-40 Cel	Tin (Sn)		DUAL	2.45 mm		7.5 mm				30	260	10.3 mm		CMOS		13.5 V			.5 mm	R-PDSO-G36	3			e3
PV912NE812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel			QUAD	1.6 mm		14 mm						14 mm		CMOS		3.3 V			.5 mm	S-PQFP-G100

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.