AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 253

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

PCIMX516AJM6C

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

529

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.175 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

19 mm

40

260

19 mm

CMOS

1.225 V

.8 mm

S-PBGA-B529

3

Not Qualified

e1

PM9Z1J638AM2EPR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.5 V

125 Cel

-40 Cel

QUAD

.9 mm

7 mm

7 mm

CMOS

6 V

.5 mm

S-XQCC-N48

MPXY8510DK016T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

MPXY8610DK6T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

PM912KS812AMAF

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

.5 mm

S-PQFP-G100

MPXV8510DK016T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

MFR4310MAE40

NXP Semiconductors

AUTOMOTIVE

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

FLATPACK

QFP64,.47SQ,20

125 Cel

-40 Cel

QUAD

CMOS

Other Microprocessor ICs

.5 mm

S-PQFP-G64

Not Qualified

MPXY8600DK6T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

MPXV8500DK016T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

PM912KS812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

.5 mm

S-PQFP-G100

PM9Z1J638AM2EP

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.5 V

125 Cel

-40 Cel

QUAD

.9 mm

7 mm

7 mm

CMOS

6 V

.5 mm

S-XQCC-N48

SFR4310E1MAE40R

NXP Semiconductors

AUTOMOTIVE

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

FLATPACK

QFP64,.47SQ,20

125 Cel

-40 Cel

TIN

QUAD

40

260

CMOS

Other uPs/uCs/Peripheral ICs

.5 mm

S-PQFP-G64

3

Not Qualified

e3

PM912JS812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

.5 mm

S-PQFP-G100

PM912JS812AMAF

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

.5 mm

S-PQFP-G100

MM912JP812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

36 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

4.7 V

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

.5 mm

S-PQFP-G100

3

e3

MM912KS812AMAF

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

3

e3

JN5178

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

125 Cel

-40 Cel

QUAD

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

CMOS

3 V

.5 mm

S-PQCC-N40

JN5179

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

125 Cel

-40 Cel

QUAD

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

CMOS

3 V

.5 mm

S-PQCC-N40

MM912JS812AMAF

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

3

e3

MC9S12XEP100

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

1.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

MM912JS812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

3

e3

MM912IP812AMAF

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

36 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

4.7 V

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

.5 mm

S-PQFP-G100

3

e3

JN5174

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

125 Cel

-40 Cel

QUAD

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

CMOS

3 V

.5 mm

S-PQCC-N40

MM912IP812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

36 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

4.7 V

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

.5 mm

S-PQFP-G100

3

e3

MM912JP812AMAF

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

36 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

4.7 V

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

.5 mm

S-PQFP-G100

3

e3

MM912KS812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

3

e3

MCIMX6Q6AVT08AC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MCIMX6G1AVM07AA

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.25 V

125 Cel

-40 Cel

BOTTOM

1.32 mm

14 mm

40

260

14 mm

CMOS

.8 mm

S-PBGA-B289

3

MCIMX6D4AVT08AD

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MCIMX6Q6AVT08AE

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.225 V

125 Cel

-40 Cel

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

MCIMX6Q6AVT08AD

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MCIMX6D4AVT08AC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MCIMX6D4AVT10AD

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MIMX8DX6AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

609

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, FINE PITCH

BGA609,35X35,32

1.05 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

2.52 mm

21 mm

40

260

21 mm

CMOS

1.1 V

.8 mm

S-PBGA-B609

3

e2

MCIMX6DP4AVT8AB

NXP Semiconductors

SoC

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MIMX8DX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

417

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, FINE PITCH

BGA417,29X29,32

1.05 V

125 Cel

-40 Cel

BOTTOM

2.73 mm

17 mm

40

260

17 mm

CMOS

1.1 V

.8 mm

S-PBGA-B417

3

MIMX8DX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

609

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, FINE PITCH

BGA609,35X35,32

1.05 V

125 Cel

-40 Cel

BOTTOM

2.52 mm

21 mm

40

260

21 mm

CMOS

1.1 V

.8 mm

S-PBGA-B609

3

MCIMX6QP6AVT8AA

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MCIMX516AJM6C

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

529

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

1.2

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

.95 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

19 mm

40

260

19 mm

CMOS

1 V

Graphics Processors

.8 mm

S-PBGA-B529

3

Not Qualified

e1

MCIMX6D4AVT08AER

NXP Semiconductors

SoC

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MCIMX6Q4AVT10ACR

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MCIMX6Q4AVT08ACR

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MIMX8QX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

609

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, FINE PITCH

BGA609,35X35,32

1.05 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

2.52 mm

21 mm

40

260

21 mm

CMOS

1.1 V

.8 mm

S-PBGA-B609

3

e2

MIMX8QX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

609

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, FINE PITCH

BGA609,35X35,32

1.05 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

2.52 mm

21 mm

40

260

21 mm

CMOS

1.1 V

.8 mm

S-PBGA-B609

3

e2

MCIMX6D4AVT08ACR

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MCIMX6Q4AVT08AC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.225 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MCIMX6U6AVM08ADR

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.275 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MCIMX6Q4AVT08AE

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.225 V

125 Cel

-40 Cel

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.