Analog Devices Other Function uPs,uCs & Peripheral ICs 309

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ADT7475ARQ-REEL

Analog Devices

AD6620AS

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK

QFP80,.7SQ

3 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

3.4 mm

14 mm

30

240

14 mm

CMOS

3.3 V

DSP Peripherals

.65 mm

S-PQFP-G80

3

Not Qualified

e0

IA82510-PLC28I-00

Analog Devices

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC28,.5SQ

85 Cel

-40 Cel

TIN LEAD

QUAD

235

22.4 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J28

3

Not Qualified

e0

IA80152JA-PDW48C

Analog Devices

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP48,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

.1 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T48

Not Qualified

e0

AD1818JS

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

FLATPACK, FINE PITCH

4.75 V

70 Cel

0 Cel

TIN LEAD

QUAD

3.4 mm

14 mm

20 mm

CMOS

5 V

.5 mm

R-PQFP-G128

Not Qualified

e0

IA8344-PDW40I-P03

Analog Devices

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

DUAL

50 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

IA8X44PDW40I3

Analog Devices

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

85 Cel

-40 Cel

QUAD

CMOS

50 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J44

Not Qualified

ADSP-SC583KBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-SC587KBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADN2855ACPZ-R7

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1 mm

5 mm

30

260

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

3

Not Qualified

e3

ADSP-21583-ENG

Analog Devices

MICROPROCESSOR CIRCUIT

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

BOTTOM

1.5 mm

19 mm

19 mm

CMOS

1.1 V

.8 mm

S-PBGA-B349

IA8344-PLC44I-P03

Analog Devices

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

85 Cel

-40 Cel

QUAD

50 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J44

Not Qualified

ADDI7013BBCZ

Analog Devices

260

3

ADSP-21584CBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA82050-PLC28IR2

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

CHIP CARRIER

LDCC28,.5SQ

85 Cel

-40 Cel

QUAD

4.57 mm

11.5 mm

20 MHz

11.5 mm

CMOS

1.27 mm

S-PQCC-J28

ADSP-SC589BBCZ-5B

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-21584KBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

IA8255-PDW40I

Analog Devices

ADT7475ARQ-REEL7

Analog Devices

IA82050-PDW28C-01

Analog Devices

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP28,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T28

Not Qualified

e0

IA80152JB-PLC68C

Analog Devices

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

ADUCM330WDCPZ

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

.5 mm

S-XQCC-N32

ADDI7013BBCZRL

Analog Devices

30

260

3

IA82510-PDW28C-00

Analog Devices

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP28,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

22.4 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T28

Not Qualified

e0

ADSP-SC584KBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-SC584-ENG

Analog Devices

MICROPROCESSOR CIRCUIT

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

BOTTOM

1.5 mm

19 mm

19 mm

CMOS

1.1 V

.8 mm

S-PBGA-B349

IA82510-PLC28C-00

Analog Devices

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC28,.5SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

22.4 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J28

3

Not Qualified

e0

IA82050-PLC28I-01

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC28,.5SQ

85 Cel

-40 Cel

TIN LEAD

QUAD

4.57 mm

11.5 mm

20 MHz

235

11.5 mm

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J28

3

Not Qualified

e0

IA8044-PDW40I-R-P03

Analog Devices

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

DUAL

50 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

IA80152JD-PLC68I

Analog Devices

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

85 Cel

-40 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

IA8255-PLC44I

Analog Devices

IA82510-PLC28I-R-01

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP28,.6

85 Cel

-40 Cel

DUAL

5.08 mm

13.71 mm

20 MHz

36.19 mm

5.5 V

2.54 mm

R-PDIP-T28

ADSP-SC587BBCZ-5B

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA82050-PLC28C-01

Analog Devices

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC28,.5SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J28

3

Not Qualified

e0

ADSP-21583CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

IA8237-PDW40C

Analog Devices

ADT7475ARQ

Analog Devices

ADSP-SC584BBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA82510-PDW28C-01

Analog Devices

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP28,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

22.4 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T28

Not Qualified

e0

IA82510-CLL28M-00

Analog Devices

MILITARY

J BEND

28

QCCJ

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LDCC28,.5SQ

125 Cel

-55 Cel

TIN LEAD

QUAD

235

22.4 mA

5 V

Other Microprocessor ICs

1.27 mm

S-XQCC-J28

3

Not Qualified

e0

AD6721

Analog Devices

ADSP-SC583BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

IA82510-CD28M-01

Analog Devices

MILITARY

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP28,.6

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

22.4 mA

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T28

Not Qualified

e0

ADSP-SC589BBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA80152JC-PDW48C

Analog Devices

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP48,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

.1 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T48

Not Qualified

e0

IA8255-PLC44C

Analog Devices

IA80152JA-PDW48I

Analog Devices

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP48,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

.1 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T48

Not Qualified

e0

AD891AJD

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

IN-LINE

70 Cel

0 Cel

TIN LEAD

DUAL

5.08 mm

7.62 mm

19.43 mm

CMOS

2.54 mm

R-CDIP-T14

Not Qualified

e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.