Analog Devices Other Function uPs,uCs & Peripheral ICs 309

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ADSP-SC584KBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA8237(40DIP)

Analog Devices

AD5564B

Analog Devices

ADSP-21583KBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

IA80C152JB-PLC68I-R-01

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

QUAD

5.08 mm

25.15 mm

8

16.5 MHz

25.15 mm

CMOS

5 V

UART

1.27 mm

S-PQCC-J68

AD892EJP

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER

70 Cel

0 Cel

TIN LEAD

QUAD

4.57 mm

16.5862 mm

ALSO REQUIRES 12V SUPPLY

16.5862 mm

CMOS

5 V

1.27 mm

S-PQCC-J44

Not Qualified

e0

IA8044-PDW40I-P03

Analog Devices

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

DUAL

50 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

AD9807JS-REEL

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK

4.75 V

70 Cel

0 Cel

QUAD

2.35 mm

14 mm

14 mm

CMOS

5 V

.8 mm

S-PQFP-G64

Not Qualified

IA8044-PLC44I-P03

Analog Devices

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

85 Cel

-40 Cel

QUAD

50 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J44

Not Qualified

ADSP-21571-SWZENG

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.47 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

3.13 V

70 Cel

0 Cel

QUAD

1.6 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

24 mm

CMOS

3.3 V

.5 mm

S-PQFP-G176

IA8344-PDW40I-R-P03

Analog Devices

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

DUAL

50 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

IA82510-PLC28C-01

Analog Devices

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC28,.5SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

22.4 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J28

3

Not Qualified

e0

AD9805JS

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK

4.75 V

70 Cel

0 Cel

QUAD

2.35 mm

14 mm

14 mm

CMOS

5 V

.8 mm

S-PQFP-G64

Not Qualified

ADSP-SC583BBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

IA80152JC-PLC68I

Analog Devices

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

85 Cel

-40 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

ADSP-SC582BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADSP-21573-BCZENG

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

GRID ARRAY, LOW PROFILE, FINE PITCH

3.13 V

70 Cel

0 Cel

BOTTOM

1.5 mm

17 mm

17 mm

CMOS

3.3 V

.8 mm

S-PBGA-B400

ADUCM331WDCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

.5 mm

S-XQCC-N32

IA80152JA-PLC68C

Analog Devices

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

ADSP-21584KBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-SC582CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADRF8800

Analog Devices

MICROPROCESSOR CIRCUIT

ADRF8850

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC595WCBPZ6RL

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC596WCBPZ10

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC596BBPZ10

Analog Devices

MICROPROCESSOR CIRCUIT

ADSPSC598WCBPZ10RL

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC598WCBPZ8RL

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC595WCBPZ6

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC598BBPZ10

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC595WCBPZ8RL

Analog Devices

MICROPROCESSOR CIRCUIT

ADSPSC596WCBPZ10RL

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC598KBPZ10

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC596KBPZ10

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC598WCBPZ10

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC598WCBPZ8

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC595WCBPZ8

Analog Devices

MICROPROCESSOR CIRCUIT

DS8314L-RRX+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE

SOP28,.4

2.7 V

85 Cel

-40 Cel

DUAL

2.65 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

17.9 mm

CMOS

85 mA

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

Not Qualified

71M6545H-IGT/F

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

Not Qualified

DS1209S-16

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

SMALL OUTLINE

SOP16,.4

70 Cel

0 Cel

TIN LEAD

DUAL

CMOS

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G16

Not Qualified

e0

71M6545-IGT/F

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

Not Qualified

MAX78002GXE+

Analog Devices

MICROPROCESSOR, RISC

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.21 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

.9 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

30

260

12 mm

CMOS

1.1 V

.8 mm

S-PBGA-B144

3

e1

73S1120F-CGTR

Analog Devices

73S1120F-CGT

Analog Devices

MAX7359ETG+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.13SQ,16

1.62 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

.85 mm

3.5 mm

30

260

3.5 mm

BICMOS

.06 mA

2.5 V

Parallel IO Port

.4 mm

S-XQCC-N24

1

Not Qualified

e3

MAX66240ESA+

Analog Devices

CRYPTOGRAPHIC AUTHENTICATOR

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

SOP8,.25

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

CMOS

1.27 mm

R-PDSO-G8

1

e3

71M6403-IGT/F

Analog Devices

MAX11810EWE+

Analog Devices

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.