Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
2.4 V |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.73 mm |
3.9 mm |
MONITORS UP TO 40 KEYS |
30 |
260 |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
3.3,5 |
SMALL OUTLINE |
SOP28,.4 |
2.7 V |
85 Cel |
-40 Cel |
DUAL |
2.65 mm |
7.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17.9 mm |
CMOS |
85 mA |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.16,20 |
2.97 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.8 mm |
3 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-N10 |
1 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE |
SOP8,.25 |
2.97 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G8 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
SMALL OUTLINE |
SOP16,.4 |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
CMOS |
.5 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
RECTANGULAR |
UNSPECIFIED |
YES |
109 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
30 |
260 |
CMOS |
R-XQCC-N20 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
MONITORS UP TO 64 KEYS |
30 |
260 |
4 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.5 mm |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.24 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.73 mm |
3.9 mm |
MONITORS UP TO 64 KEYS |
30 |
260 |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
MONITORS UP TO 64 KEYS |
30 |
260 |
4 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.5 mm |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.24 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.73 mm |
3.9 mm |
30 |
260 |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
C BEND |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.89 V |
SMALL OUTLINE |
1.71 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.5 mm |
30 |
260 |
CMOS |
1.8 V |
1.27 mm |
R-PDSO-C6 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC6,.12,37 |
2.97 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
.8 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
3.3 V |
.95 mm |
S-PDSO-N6 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
C BEND |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.89 V |
SMALL OUTLINE |
1.71 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.5 mm |
30 |
260 |
CMOS |
1.8 V |
1.27 mm |
R-PDSO-C6 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC6,.12,37 |
2.97 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
.8 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
3.3 V |
.95 mm |
S-PDSO-N6 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
.5 mA |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
.5 mA |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC6,.12,37 |
2.97 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
.8 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
3.3 V |
.95 mm |
S-PDSO-N6 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
NICKEL PALLADIUM GOLD |
30 |
260 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC6,.12,37 |
2.2 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
.8 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
3.3 V |
.95 mm |
S-PDSO-N6 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
NICKEL GOLD PALLADIUM |
30 |
260 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.8 mm |
3 mm |
30 |
260 |
4 mm |
CMOS |
5 V |
.5 mm |
R-PDSO-N14 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
1.752 mm |
3.9 mm |
8.649 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1.752 mm |
3.9 mm |
8.649 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
1.752 mm |
3.899 mm |
30 |
260 |
8.649 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
14 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.8 mm |
3 mm |
4 mm |
CMOS |
5 V |
.5 mm |
R-PDSO-N14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
14 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
4.5 V |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
.8 mm |
3 mm |
4 mm |
CMOS |
5 V |
.5 mm |
R-PDSO-N14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.8 mm |
3 mm |
30 |
260 |
4 mm |
CMOS |
5 V |
.5 mm |
R-PDSO-N14 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.8 mm |
3 mm |
30 |
260 |
4 mm |
CMOS |
5 V |
.5 mm |
R-PDSO-N14 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.8 mm |
3 mm |
4 mm |
CMOS |
5 V |
.5 mm |
R-PDSO-N14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC6,.12,38 |
2.2 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
.8 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
3.3 V |
.95 mm |
S-PDSO-N6 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
C BEND |
6 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.8 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
30 |
260 |
CMOS |
3.3 V |
R-PDSO-C6 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
.5 mA |
5 V |
1.27 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.16,20 |
2.97 V |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
.8 mm |
3 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-N10 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
3.3,5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.1 mm |
4.4 mm |
30 |
260 |
9.7 mm |
CMOS |
215 mA |
3.3 V |
Other Microprocessor ICs |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
48 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 V |
3.3 |
FLATPACK, LOW PROFILE |
QFP48,.35SQ,20 |
2.7 V |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
7 mm |
AVAILABLE IN 0.5 PITCH ALSO |
30 |
260 |
7 mm |
CMOS |
325 mA |
3.3 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G48 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.1 mm |
4.4 mm |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G28 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
C BEND |
6 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.8 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
30 |
260 |
CMOS |
3.3 V |
R-PDSO-C6 |
1 |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.