Analog Devices Other Function uPs,uCs & Peripheral ICs 309

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
DS28C22Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	2 mm		30	260	3 mm	CMOS		3.3 V	.5 mm	R-PDSO-N8	1		e3
MXD1210CSA+T	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA	5 V	1.27 mm	R-PDSO-G8	1	Not Qualified	e3
DS28E10R+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			2.8 V	85 Cel	-40 Cel		DUAL				30	260		CMOS		3.3 V		R-PDSO-G3
DS8007A-EAG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V	FLATPACK, LOW PROFILE		2.7 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	7 mm	AVAILABLE IN 0.5 PITCH ALSO	30	260	7 mm	CMOS		3.3 V	.8 mm	S-PQFP-G48	1		e3
DS8024M-RJX+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.1 mm	4.4 mm		30	260	9.7 mm	CMOS		3.3 V	.65 mm	R-PDSO-G28	1		e3
DS28C36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V	.95 mm	S-PDSO-N6	1		e3
DS28E38Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V	.95 mm	S-XDSO-N6	1		e3
DS28E84Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V	.95 mm	S-XDSO-N6	1		e3
DS28S60Q+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20	1.62 V	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V	.5 mm	S-XDSO-N12	1		e3
DS28C22Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	2 mm		30	260	3 mm	CMOS		3.3 V	.5 mm	R-PDSO-N8	1		e3
MXD1210CWE+T	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm				9.9 mm	CMOS	.5 mA	5 V	1.27 mm	R-PDSO-G16	1	Not Qualified	e3
MXD1210CSA+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA	5 V	1.27 mm	R-PDSO-G8	1	Not Qualified	e3
DS28E39Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V	.95 mm	S-XDSO-N6	1		e3
MXD1210ESA+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA	5 V	1.27 mm	R-PDSO-G8	1	Not Qualified	e3
DS28E83Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V	.95 mm	S-PDSO-N6	1		e3
MXD1210CPA+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	IN-LINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	4.572 mm	7.62 mm		30	260	9.375 mm	CMOS	.5 mA	5 V	2.54 mm	R-PDIP-T8	1	Not Qualified	e3
MXD1210EPA+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	IN-LINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	4.572 mm	7.62 mm		30	260	9.375 mm	CMOS	.5 mA	5 V	2.54 mm	R-PDIP-T8	1	Not Qualified	e3
DS28E10R+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL				30	260		CMOS		3.3 V		R-PDSO-G3	1		e3
DS28E36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V	.95 mm	S-XDSO-N6	1		e3
DS28E83G+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR
DS28E40G/V+T	Analog Devices	MICROPROCESSOR CIRCUIT																			NOT SPECIFIED	NOT SPECIFIED

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.