Analog Devices Other Function uPs,uCs & Peripheral ICs 309

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
ADV202JB	Analog Devices
ADUCM331WDCPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm						6 mm	CMOS					.5 mm	S-XQCC-N32
ADSP-SC582KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
IA80152JC-PDW48I	Analog Devices		INDUSTRIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			5	IN-LINE	DIP48,.6		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL									CMOS	.1 mA	5 V	Other Microprocessor ICs		2.54 mm	R-PDIP-T48		Not Qualified	e0
IA82510-CLC28M-01	Analog Devices		MILITARY	J BEND	28	QCCJ	SQUARE	CERAMIC	YES			5	CHIP CARRIER	LDCC28,.5SQ		125 Cel	-55 Cel	TIN LEAD	QUAD							235			22.4 mA	5 V	Other Microprocessor ICs		1.27 mm	S-XQCC-J28	3	Not Qualified	e0
ADSP-SC584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADUCM350BBCZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.35 mm	8 mm				30	260	8 mm	CMOS		3 V			.5 mm	S-PBGA-B120	3		e1
ADSP-SC584CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
IA82050-PLC28I-R-01	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES				CHIP CARRIER	LDCC28,.5SQ		85 Cel	-40 Cel		QUAD	4.57 mm	11.5 mm			20 MHz			11.5 mm	CMOS		5 V			1.27 mm	S-PQCC-J28
ADSP-21584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
IA8X44PLC44I3	Analog Devices		INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC44,.7SQ		85 Cel	-40 Cel		QUAD									CMOS	50 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	S-PQCC-J44		Not Qualified
ADSP-SC571-SWZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		QUAD	1.6 mm	24 mm				NOT SPECIFIED	NOT SPECIFIED	24 mm	CMOS		3.3 V			.5 mm	S-PQFP-G176
IA8237-PLC44C	Analog Devices
ADSP-SC573-BCZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		BOTTOM	1.5 mm	17 mm						17 mm	CMOS		3.3 V			.8 mm	S-PBGA-B400
ADSP-SC584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
IA82510-CLC28M-00	Analog Devices		MILITARY	J BEND	28	QCCJ	SQUARE	CERAMIC	YES			5	CHIP CARRIER	LDCC28,.5SQ		125 Cel	-55 Cel	TIN LEAD	QUAD							235			22.4 mA	5 V	Other Microprocessor ICs		1.27 mm	S-XQCC-J28	3	Not Qualified	e0
IA82050-PDW28I-01	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			5	IN-LINE	DIP28,.6		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	5.08 mm	13.17 mm			20 MHz				CMOS		5 V	Other Microprocessor ICs		2.54 mm	R-PDIP-T28		Not Qualified	e0
IA8237-PLC44I	Analog Devices
FIDO1100BGA208IR1	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC	YES	2.75 V			GRID ARRAY	BGA208,18X18,20	2.25 V	85 Cel	-40 Cel		BOTTOM	1.2 mm	10 mm		16	2.6 MHz			10 mm			2.5 V		SPI; UART	.5 mm	S-PBGA-B208
AD6620ASZ-REEL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN	QUAD	3.4 mm	14 mm				40	260	14 mm	CMOS		3.3 V	DSP Peripherals		.65 mm	S-PQFP-G80	3	Not Qualified	e3
IA82510-CLL28M-01	Analog Devices		MILITARY	J BEND	28	QCCJ	SQUARE	CERAMIC	YES			5	CHIP CARRIER	LDCC28,.5SQ		125 Cel	-55 Cel	TIN LEAD	QUAD							235			22.4 mA	5 V	Other Microprocessor ICs		1.27 mm	S-XQCC-J28	3	Not Qualified	e0
ADSP-SC583KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADUCM331WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS				SPI	.5 mm	S-XQCC-N32
IA8237-PDW40I	Analog Devices
IA80152JD-PLC68C	Analog Devices		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	TIN LEAD	QUAD							235		CMOS	.1 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J68	3	Not Qualified	e0
AD891AJP	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES				CHIP CARRIER			70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	8.9662 mm						8.9662 mm	CMOS					1.27 mm	S-PQCC-J20		Not Qualified	e0
IA8237(44LCC)	Analog Devices
AD6722	Analog Devices
ADSP-SC584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
IA82510-CD28M-00	Analog Devices		MILITARY	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO			5	IN-LINE	DIP28,.6		125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	DUAL										22.4 mA	5 V	Other Microprocessor ICs		2.54 mm	R-XDIP-T28		Not Qualified	e0
ADN2855ACPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm				30	260	5 mm	CMOS		3.3 V			.5 mm	S-XQCC-N32	3	Not Qualified	e3
ADSP-21584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADUCM350BBCZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.35 mm	8 mm				30	260	8 mm	CMOS		3 V			.5 mm	S-PBGA-B120	3		e1
ADMC201AP	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V			CHIP CARRIER		4.75 V	85 Cel	-40 Cel	TIN LEAD	QUAD	4.45 mm	24.1808 mm						24.1808 mm	CMOS		5 V			1.27 mm	S-PQCC-J68		Not Qualified	e0
AD892TJP	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES				CHIP CARRIER			70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	16.5862 mm	ALSO REQUIRES 12V SUPPLY					16.5862 mm	CMOS		5 V			1.27 mm	S-PQCC-J44		Not Qualified	e0
ADSP-SC583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
AD6620AS-REEL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK		3 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	3.4 mm	14 mm				30	240	14 mm	CMOS		3.3 V			.65 mm	S-PQFP-G80	3	Not Qualified	e0
ADSP-21584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
IA80C152JD-PLC68I-R-01	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V			CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel	-40 Cel		QUAD	5.08 mm	25.15 mm		8	16.5 MHz			25.15 mm	CMOS		5 V		UART	1.27 mm	S-PQCC-J68
ADSP-SC587KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADUCM330WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm						6 mm	CMOS					.5 mm	S-XQCC-N32
AD9807JS	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V			FLATPACK		4.75 V	70 Cel	0 Cel		QUAD	2.35 mm	14 mm						14 mm	CMOS		5 V			.8 mm	S-PQFP-G64		Not Qualified
IA8255-PDW40C	Analog Devices
IA80152JB-PLC68I	Analog Devices		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel	-40 Cel	TIN LEAD	QUAD							235		CMOS	.1 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J68	3	Not Qualified	e0
AD9807	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V			FLATPACK		4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	2.35 mm	14 mm						14 mm	CMOS		5 V			.8 mm	S-PQFP-G64		Not Qualified	e0
ADSP-SC584KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
IA80152JC-PLC68C	Analog Devices		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	TIN LEAD	QUAD							235		CMOS	.1 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J68	3	Not Qualified	e0
IA80152JA-PLC68I	Analog Devices		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel	-40 Cel	TIN LEAD	QUAD							235		CMOS	.1 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J68	3	Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.