Analog Devices Other Function uPs,uCs & Peripheral ICs 309

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
DS28CM00R-A00+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		1.62 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.45 mm	1.625 mm	IT ALSO OPERATE AT 1.8 V SUPPLY		30	260	2.9 mm	CMOS		5 V			.95 mm	R-PDSO-G5	1	Not Qualified	e3
LTC4263IS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	MATTE TIN	DUAL	1.752 mm	3.899 mm			30	260	8.649 mm	CMOS		5 V			1.27 mm	R-PDSO-G14	1	Not Qualified	e3
DS8007-ENG+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	7 mm			30	260	7 mm	CMOS	325 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQFP-G48	1	Not Qualified	e3
LTC4263CS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.752 mm	3.899 mm			30	260	8.649 mm	CMOS		5 V			1.27 mm	R-PDSO-G14	1	Not Qualified	e3
LTC4263IDE#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel	-40 Cel	MATTE TIN	DUAL	.8 mm	3 mm			30	260	4 mm	CMOS		5 V			.5 mm	R-PDSO-N14	1	Not Qualified	e3
LTC4263IDE-1#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel	-40 Cel	MATTE TIN	DUAL	.8 mm	3 mm			30	260	4 mm	CMOS		5 V			.5 mm	R-PDSO-N14	1	Not Qualified	e3
MAXQ1061EUD+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES							109 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL					30	260		CMOS						R-PDSO-G14	1		e3
DS28CM00R-A00+U	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	5	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V			SMALL OUTLINE		1.62 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL			ALSO AVAILABLE IN 5V		30	260		CMOS		1.8 V				R-PDSO-G5	1		e3
MXD1210EWE+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm			30	260	9.9 mm	CMOS		5 V			1.27 mm	R-PDSO-G16	1	Not Qualified	e3
ADDI7015BBCZ	Analog Devices																								260									3
ADDI7015BBCZRL	Analog Devices																								260									3
ADSP-SC589-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm	19 mm					19 mm	CMOS		1.1 V			.8 mm	S-PBGA-B529
MXD1210CWE+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm			30	260	9.9 mm	CMOS		5 V			1.27 mm	R-PDSO-G16	1	Not Qualified	e3
DS28C16Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR																Matte Tin (Sn) - annealed						30	260									1		e3
ADSP-21583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
DS28E36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm			30	260	3 mm	CMOS		3.3 V			.95 mm	S-XDSO-N6	1		e3
DS8023-RJX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V		3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.1 mm	4.4 mm			30	260	9.7 mm	CMOS	215 mA	3.3 V	Other Microprocessor ICs		.65 mm	R-PDSO-G28	1	Not Qualified	e3
DS8023-RJX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.1 mm	4.4 mm	ALSO AVAILABLE IN 5V		30	260	9.7 mm	CMOS		3.3 V			.65 mm	R-PDSO-G28	1		e3
DS8023-RRX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V		3.3,5	SMALL OUTLINE	SOP28,.4	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	2.65 mm	7.5 mm			30	260	17.9 mm	CMOS	215 mA	3.3 V	Other Microprocessor ICs		1.27 mm	R-PDSO-G28	1	Not Qualified	e3
DS8023-RRX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE		2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	2.65 mm	7.5 mm	ALSO AVAILABLE IN 5V		30	260	17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28	1		e3
LTC4263IDE-1#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel	-40 Cel	MATTE TIN	DUAL	.8 mm	3 mm			30	260	4 mm	CMOS		5 V			.5 mm	R-PDSO-N14	1	Not Qualified	e3
LTC4263IS#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	MATTE TIN	DUAL	1.752 mm	3.899 mm			30	260	8.649 mm	CMOS		5 V			1.27 mm	R-PDSO-G14	1	Not Qualified	e3
ADSP-SC583CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
DS2465P+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE		2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm	3.76 mm			30	260	3.94 mm	CMOS		3.3 V			1.27 mm	R-PDSO-C6	1		e3
LTC4263CDE#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel	0 Cel	MATTE TIN	DUAL	.8 mm	3 mm			30	260	4 mm	CMOS		5 V			.5 mm	R-PDSO-N14	1	Not Qualified	e3
MAXQ1061EUD+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES							109 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL					30	260		CMOS						R-PDSO-G14	1		e3
DS2465P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE		2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm	3.76 mm			30	260	3.94 mm	CMOS		3.3 V			1.27 mm	R-PDSO-C6	1		e3
DS28C40G/V+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	AEC-Q100		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm			30	260	4 mm	CMOS		3.3 V			.5 mm	R-PDSO-N10	1		e3
LTC4263IDE	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, VERY THIN PROFILE		4.5 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.8 mm	3 mm					4 mm	CMOS		5 V			.5 mm	R-PDSO-N14	1	Not Qualified	e0
LTC4263IS	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	1.752 mm	3.9 mm					8.649 mm	CMOS		5 V			1.27 mm	R-PDSO-G14	1	Not Qualified	e0
LTC4263IS#TR	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	TIN LEAD	DUAL	1.752 mm	3.9 mm					8.649 mm	CMOS		5 V			1.27 mm	R-PDSO-G14	1	Not Qualified	e0
AD6620ASZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN	QUAD	3.4 mm	14 mm				260	14 mm	CMOS		3.3 V	DSP Peripherals		.65 mm	S-PQFP-G80	3	Not Qualified	e3
DS3655B+	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY		3 V	85 Cel	-40 Cel		BOTTOM								CMOS		3.3 V				S-PBGA-B16	3
DS3655B+TRL	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY		3 V	85 Cel	-40 Cel		BOTTOM								CMOS		3.3 V				S-PBGA-B16	3
MAXQ1065GTC+T	Analog Devices	MICROPROCESSOR CIRCUIT																Matte Tin (Sn) - annealed						30	260									1		e3
MXD1210EWE+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm					9.9 mm	CMOS	.5 mA	5 V			1.27 mm	R-PDSO-G16	1	Not Qualified	e3
ADSP-SC598BBPZ8	Analog Devices	MICROPROCESSOR CIRCUIT
ADSP-SC598KBPZ8	Analog Devices	MICROPROCESSOR CIRCUIT
DS28E10R+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL					30	260		CMOS		3.3 V				R-PDSO-G3	1		e3
DS28E50Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm			30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADUCM330WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS				SPI	.5 mm	S-XQCC-N32
ADMC200AP	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V			CHIP CARRIER		4.75 V	85 Cel	-40 Cel	TIN LEAD	QUAD	4.45 mm	24.1808 mm					24.1808 mm	CMOS		5 V			1.27 mm	S-PQCC-J68		Not Qualified	e0
IA82510-PDW28I-00	Analog Devices		INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			5	IN-LINE	DIP28,.6		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL									22.4 mA	5 V	Other Microprocessor ICs		2.54 mm	R-PDIP-T28		Not Qualified	e0
AD897JS	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK			70 Cel	0 Cel	TIN LEAD	QUAD	2.39 mm	10 mm	ALSO REQUIRES 12V SUPPLY				10 mm	CMOS		5 V			.65 mm	S-PQFP-G52		Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.