Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVC1502-2MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XQZU7EV-1FFRC900I	Xilinx	PROGRAMMABLE RFSoC
XCVC1902-2MSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XQZU11EG-L1FFRB1517I	Xilinx	PROGRAMMABLE RFSoC
XCVC1502-2MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC2802-1MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XQZU15EG-1FFRC1760M	Xilinx	PROGRAMMABLE RFSoC
XCVC1702-1LSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1352-2MSINSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1902-2MSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC2602-2MLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1502-2MLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC2602-3HSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel	BOTTOM				CMOS	.88 V		S-PBGA-B1369
XQZU11EG-1FFRB1517I	Xilinx	PROGRAMMABLE RFSoC
XCVC1352-2LLENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2602-2MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1352-1LSENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2602-1LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1902-1LSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC2802-2MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-2LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2602-1LSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1902-1MLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC2602-2MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1902-1MSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1MSINSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XQZU15EG-L1FFRB1517I	Xilinx	PROGRAMMABLE RFSoC
XQZU7EV-2FFRB1156I	Xilinx	PROGRAMMABLE RFSoC
XCVC1502-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVC1702-2MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XQZU7EV-1FFRB1156M	Xilinx	PROGRAMMABLE RFSoC
XCVC2602-1MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XQZU15EG-2FFRC1760I	Xilinx	PROGRAMMABLE RFSoC
XCVC1902-2LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1MSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2LLENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1024
XQZU15EG-L1FFRC1760I	Xilinx	PROGRAMMABLE RFSoC
XCVC1352-1MLINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1702-2LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1902-1LLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2LSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2LSENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XQZU7EV-L1FFRB1156I	Xilinx	PROGRAMMABLE RFSoC
XCVC1902-1LSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1LLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC2802-1LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1902-2MLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.